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2 дня назад

Advanced Packaging Si/Pi Senior Staff Engineer

Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR

Advanced Packaging Si/Pi Senior Staff Engineer: Responsible for supporting customers with package designs that meet challenging electrical requirements with an accent on high speed signaling and power delivery networks. Focus on advancing expertise in 3D packaging, Co-packaged optics and cutting-edge substrate materials.

Location: Chandler, AZ or Burlington, VT

Company

hirify.global’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world.

What you will do

  • Perform SI/PI analysis of designs and optimization within 2D/2.5D/3D packages.
  • Interface with product design teams for optimized floor-planning, package related design input and power delivery network design.
  • Perform wiring studies to determine optimal signal routing, power delivery verification, and package size determination.
  • Document analysis results and present findings to internal teams.
  • Participate in cross-functional meetings and design reviews.
  • Take ownership of assigned tasks and following through to completion, adjusting approach as needed to meet goals.

Requirements

  • Bachelor's degree in electrical engineering or related field.
  • 5+ years of related professional experience in package or PCB design, or master's degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery with 3+ years of experience.
  • Understanding of signal integrity and power integrity concepts and fundamentals.
  • Experience with simulation and analysis tools such as Ansys HFSS, Keysight ADS, Cadence Sigrity tools.
  • Working knowledge of circuit extractions and simulation techniques.
  • Ability to work with engineers in multiple locations and geographies.
  • Strong communication, presentation and documentation skills.
  • Experience with developing systems with high-speed interfaces like HBM, DDR, SERDES and Die2Die interfaces.
  • Familiarity with semiconductor packaging technologies, materials, and substrate or PCB design.

Culture & Benefits

  • Employee stock purchase plan with a 2-year look back.
  • Family support programs to help balance work and home life.
  • Robust mental health resources to prioritize emotional well-being.
  • Recognition and service awards to celebrate contributions and milestones.

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