Software Engineering - Intern, Graduate (Silicon Hardware)

TL;DR

Software Engineering - Intern, Graduate (Silicon Hardware): Designing, building, and testing technology at the core of hirify.global's processors and platforms with an accent on silicon architecture, circuit design, and physical design. Focus on contributing to diverse areas of Silicon Hardware Engineering and turning innovative ideas into reality.

Location: Hybrid work model, splitting time between on-site at an assigned hirify.global site and off-site. Must be based in the US (Oregon, California, Texas, Arizona). Not available in Colorado. Relocation support available for transition to the US.

Salary: $92,800–$125,500 USD (Annual)

Company

hirify.global is a global technology corporation focused on creating exceptionally engineered technology and bringing AI everywhere through advanced computing infrastructure.

What you will do

• Contribute to the design, build, and test of technology for hirify.global's processors and platforms.
• Be involved in diverse areas of Silicon Hardware Engineering.
• Work on Silicon Architecture, Circuit Design, General Design, Layout, Logic, Photonics, Physical Design, TFM, Verification, Product Engineering, and Validation and Debug.
• Help transform raw materials into silicon for advanced computing.

Requirements

• Education: Enrolled/pursuing a Master's or Ph.D. in Computer Engineering, Computer Science, Electrical Engineering, Physics, or related STEM field.
• 3+ months of educational or industry experience.
• Location: Must be eligible to work in the US and be based in Oregon, California, Texas, or Arizona (not available in Colorado).
• Developing skills in debugging, hardware architecture, data analysis, physical and low power design, power and performance analysis, and systems architecture.
• Proficiency in programming/scripting languages (C/C++, Python, Perl, Tcl).
• Knowledge of hardware design (RTL, Verilog, VLSI), test engineering, hardware validation, and debug.

Nice to have

• GPA of 3.0 or higher.

Culture & Benefits

• Hybrid work model with split time between on-site and off-site.
• Total compensation package among the best in the industry, including competitive pay, stock bonuses, and benefit programs (health, retirement, vacation).
• Opportunity to embark on a journey of growth and transformation.
• Be part of a team driving results and relentless pursuit of quality.
• Contribute to world-changing technology that improves lives.

Hiring process

• This application is for internship starts in Spring 2026 and Summer 2026.
• Consideration also given to candidates interested in year-long internship or co-op opportunities.
• Job location and modality of work will be communicated at time of offer.