Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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$121к-232к/год
$160к$180кмедиана$200к
По похожим ролям (50) ~ $180к/год
На СНГ рынке: $1.5к/мес ($1.1к - $2.3к)
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В Company hidden чётко определена инженерная роль в передовом производстве полупроводников с заметной ответственностью за выход годных изделий и запуск технологий; обязательная работа на месте ограничивает гибкость.
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Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Process Integration, Yield, Defect Reduction Engineering Lead (Semiconductor Manufacturing): Defining process integration roadmaps and improving semiconductor manufacturing yield through data analysis, defect reduction, and advanced packaging process development with an accent on statistical analysis, machine learning, and manufacturing risk assessment. Focus on analyzing low-yield and defect data, developing monitoring systems and dashboards, and leading technology transfer and ramp-up activities in startup and high-volume manufacturing environments.
Location: On-site in Albuquerque, New Mexico, or Hillsboro, Oregon, United States
Annual salary: $120,860–$231,670 USD
Company
hirify.global advances technology solutions for high-volume manufacturing and yield improvement, including advanced packaging and reliable semiconductor products.
What you will do
Define process integration roadmaps, process flows, procedures, and equipment configurations for manufacturing modules.
Analyze structured and unstructured data using statistical analysis, coding, and machine learning techniques.
Lead yield analysis, low-yield investigations, defect reduction, and process improvement in startup and high-volume manufacturing environments.
Conduct quality and reliability risk assessments for manufacturing materials and process changes.
Collaborate with internal, external, and cross-functional teams on technology transfer and manufacturing ramp-up.
Develop monitoring systems, dashboards, and methodologies to sustain and improve manufacturing performance.
Requirements
Bachelor’s degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Material Science, Microelectronics Engineering, Chemistry, Physics, or a related field with 4+ years of experience; or a master’s degree with 3+ years; or a PhD with 1+ years.
The required experience must include semiconductor manufacturing or advanced packaging.
Expertise in process integration, defect reduction, and backend interconnect or advanced packaging processes.
Experience with statistical analysis tools such as JMP, SQL, and statistical process control (SPC).
Experience with Design of Experiments (DOE) principles and Failure Mode Effects Analysis (FMEA).
Strong troubleshooting and innovative problem-solving skills.
Excellent verbal and written communication skills.
Ability to work on-site in the United States.
Nice to have
Experience presenting yield summaries and engaging with external foundry customers.
Ability to analyze defects and parametric data to drive yield improvements.
Experience developing and transferring new semiconductor technologies.
Culture & Benefits
Full-time experienced-hire position with on-site work requirements.
Competitive pay, stock bonuses, health benefits, retirement benefits, and vacation.
Collaborative work with internal and external teams focused on high-volume manufacturing and continuous improvement.
Shift 1 schedule in the United States.
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