Senior Integration Lead - Advanced Packaging 3DHi and 2.5D

Location: Singapore; based on site with regular on-site engagement and willingness to relocate to Singapore required. Travel of up to 15% may be required.

Company

hirify.global is a full-service semiconductor foundry providing design, development, and fabrication services with a global manufacturing footprint.

What you will do

• Lead complex 3DHi and 2.5D technology development programs, translating customer requirements into integration architectures, qualification strategies, and technology roadmaps.
• Define end-to-end process flows for chiplet-based solutions, including interposers and bridges, TSVs, redistribution layers, wafer handling, bonding interfaces, assembly, and package integration.
• Own trade-off analysis across electrical performance, power delivery, signal integrity, thermal management, mechanical stress, warpage, reliability, yield, cost, and manufacturability.
• Define test sites and lead development of test structures, qualification vehicles, daisy chains, reliability structures, and electrical test methods.
• Establish process-control, inspection, metrology, defectivity, known-good-die, assembly, and qualification strategies for manufacturing readiness.
• Lead cross-functional execution through DOE planning, milestone reviews, qualification readiness, process freeze, supply-chain alignment, and manufacturing transfer.

Requirements

• Bachelor’s degree or higher in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Physics, or a related technical field.
• Relevant advanced semiconductor packaging, process integration, assembly, or heterogeneous integration experience: 10+ years with a B.S., 7+ years with an M.S., or 5+ years with a Ph.D.
• Hands-on experience leading 3DHi and/or 2.5D integration, including several of: chiplet architectures, silicon interposers or bridges, TSVs, redistribution layers, micro-bumps, Cu-Cu hybrid bonding, die-to-wafer or wafer-to-wafer bonding, wafer thinning, temporary bonding, underfill, assembly, and package qualification.
• Experience with test vehicles, DOEs, process windows, metrology and inspection plans, electrical testing, reliability qualification, failure analysis, yield improvement, and manufacturing transfer.
• Technical leadership and program ownership across cross-functional teams, global sites, suppliers, and external ecosystem partners.
• Strong written and verbal communication skills in English, with the ability to work across cultures and time zones.
• Currently based in Singapore or willing to relocate to Singapore and work on site.

Nice to have

• Advanced degree in a relevant engineering or science discipline.
• Experience in Singapore’s semiconductor ecosystem, including wafer fabs, foundries, OSATs, equipment or materials suppliers, or research institutes.
• Working relationships with Singapore-based research institutes, universities, OSATs, equipment suppliers, materials vendors, or advanced packaging partners.
• Knowledge of 2.5D/3D design enablement and co-design, including interconnect density, signal integrity, power integrity, thermal and mechanical modeling, design rules, assembly tolerances, and product-level qualification.
• Leadership of complex technology programs involving milestone execution, risk retirement, qualification readiness, and manufacturing hand-off in a high-volume environment.

Culture & Benefits

• Collaborate with engineering, manufacturing, reliability, test, supply-chain, business, and global technology teams.
• Work within a global semiconductor manufacturing organization and Singapore technology development site.
• Employment offers are subject to applicable background checks and medical screenings under local laws.
• hirify.global does not charge recruitment fees; legitimate recruitment communications use official company channels.