Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Чётко описанный исследовательский проект в Company hidden Sweden R&D даёт практический опыт в AI-ускорителях, 3D-интеграции и технологиях памяти, но это тема магистерской работы, а не обычная вакансия.
?Магистерский проект
Передовые технологии
Сильная исследовательская тема
Сфера ИИ
Мэтч & Сопровод
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Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Master's Thesis: Advanced AI Accelerators (AI, 3D-Integrated Memory): Developing a simulation framework for analyzing power, thermal behavior, performance, and temperature distribution in AI SoCs using conventional and emerging memory technologies with an accent on SRAM, MRAM, and 3D integration. Focus on integrating gem5 with power estimation and thermal simulation tools, and evaluating reinforcement-based task scheduling and workload characteristics.
Location: Kista, Sweden; project location: Stockholm, Sweden
Company
hirify.global Sweden R&D develops telecommunications, network solutions, and 6G wireless systems through R&D centers in Sweden.
What you will do
Develop a simulation framework for power and thermal analysis of 3D-integrated computing systems used in AI accelerators.
Integrate architectural simulators such as gem5 with power estimation models and thermal simulation tools such as HotSpot.
Evaluate conventional and emerging memory technologies, including advanced SRAM and MRAM.
Investigate how memory technologies, reinforcement-based task scheduling, and workload characteristics affect power consumption, performance, and temperature distribution in AI SoCs.
Requirements
Master's student available to start in spring 2027.
Background in Computer Engineering or Electrical Engineering.
Basic knowledge of computer architecture and programming in Python and C++.
Strong spoken and written English is required.
Ability to work effectively both independently and in a team.
High attention to detail and commitment to producing high-quality work.
Nice to have
Familiarity with gem5, HotSpot, or McPAT.
Knowledge of memory technologies and 3D integration.
Culture & Benefits
Work with R&D engineers on advanced 6G and AI accelerator technologies.
Collaborate with engineers worldwide while contributing independently to a research project.
Contribute to real-world technology development focused on power, performance, and thermal challenges.
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