Intern - Design Engineering (Digital Backend)

Location: Shanghai, China

Company

hirify.global develops technology and products for advanced semiconductor design and implementation.

What you will do

• Perform chip physical design, backend place-and-route, STA, and physical verification.
• Implement physical design for high-speed digital DDR, HBM, UCIe, PCIe, and eUSB IPs.
• Develop scripts and tools to improve the physical design flow.
• Complete project tasks, solve design issues, and create checks and flows to prevent recurring issues.
• Analyze PPA optimization methodologies and results and implement optimal parameters and flows for different projects.
• Collaborate with the team on backend design delivery, quality, and schedule control.

Requirements

• Master’s degree or higher in microelectronics or electronic engineering.
• Strong problem analysis and teamwork abilities.
• Strong spoken and written Chinese and English communication skills.
• Familiarity with digital backend design tools.
• Proactive attitude and sense of responsibility.

Culture & Benefits

• Full-time internship in Shanghai.
• Availability to work at least 3 days per week.
• Internship duration: 6–8 months.
• Exposure to advanced semiconductor processes, methodologies, and high-performance products operating at frequencies up to 6400MHz.