R&D Test Engineer (3D Integration and Interconnect Characterization and Automation)

Location: Leuven, Belgium; onsite at hirify.global's headquarters.

Company

hirify.global is a nanotechnology research center focused on developing advanced semiconductor and 3D integration technologies.

What you will do

• Define and optimize design of experiments, translating technology and characterization questions into efficient experimental plans.
• Use simulation results and experimental feedback to refine experiments and validate results.
• Collaborate with process, integration, CAD, research, and project teams to define test requirements, assess results, and troubleshoot characterization challenges.
• Perform hands-on electrical measurements on wafer-level test structures, investigate anomalies, and test hypotheses.
• Support automated parametric testing and automate characterization workflows to improve throughput and reproducibility.
• Present results to hirify.global partners, publish applicable findings in scientific venues, share expertise, and implement AI and computational methods for experiment design, test structure generation, measurement planning, and data analysis.

Requirements

• Master's degree in electrical engineering, electronics, physics, or a related technical field; candidates with a relevant PhD or equivalent practical experience are also welcome.
• Experience in electrical characterization, semiconductor testing, or measurement instrumentation.
• Solid understanding of electrical parameters and measurement principles, particularly capacitance measurements and characterization of IC interconnect structures.
• Analytical mindset and interest in the physical and technological factors behind observed electrical behavior.
• Ability to work independently and collaborate effectively with multidisciplinary research and engineering teams.
• Good communication skills and ability to document and explain technical results clearly.
• Proactive, precise, and quality-conscious working style; team-player approach.
• Proficient written and spoken English.

Nice to have

• Experience with 3D integration or advanced semiconductor packaging.
• Familiarity with TSVs, hybrid bonding, microbumps, metal interconnects, or metal redistribution layers.
• Practical experience with wafer probing, semiconductor parameter analyzers, LCR meters, or other electrical characterization instruments.
• Knowledge of capacitance modeling, parasitic extraction, or interpretation of electrical test structures.
• Experience developing measurement setups, defining test methodologies, or automating measurement workflows.
• Familiarity with semiconductor process integration and the relationship between process characteristics and electrical performance.
• Familiarity with CAD design.

Culture & Benefits

• Open, multicultural, informal working environment with opportunities to take initiative and responsibility.
• Development support through hirify.global.academy, the corporate university.
• Market-appropriate salary with fringe benefits.
• Inclusive employer committed to supporting employee growth.

Hiring process

• Apply directly through the hirify.global careers application for this position.
• Unsolicited resumes from agencies and other third parties are not accepted unless covered by a prior written agreement with hirify.global for this specific opening.