R&D-Package-Process Development Engineer (Semiconductor Packaging)

Location: Cabuyao, Philippines

Company

hirify.global develops semiconductor products and package technologies.

What you will do

• Support new semiconductor product and package development in line with project timelines and business requirements.
• Monitor process performance, quality, and reliability during development and identify technical issues and deviations.
• Recommend and implement corrective or improvement actions, including Design for Manufacturability activities.
• Drive process development, gap analysis, risk assessments, and Design of Experiments result reviews.
• Assess package and process integration, develop new package capabilities, and benchmark packages against industry leaders and relevant technologies.
• Establish package costing, draft process flows, and BCAMx compliance for applicable milestone gates while collaborating with suppliers and cross-functional stakeholders.

Requirements

• Strong technical knowledge of semiconductor package development, process development, and package/process integration.
• Knowledge of Design for Manufacturability, Design of Experiments, risk assessment, gap analysis, and benchmarking.
• Ability to analyze package and process performance, quality, reliability, and cost effectiveness.
• Strong problem-solving and analytical skills.
• Ability to work effectively with cross-functional teams, project leaders, and external materials and equipment suppliers.
• Strong collaboration and technical communication skills.

Culture & Benefits

• Full-time employment with a competitive salary and benefits package.
• Professional development and growth opportunities through seminars, technical reports, conferences, and other learning activities.
• Commitment to workplace safety, employee well-being, inclusion, and reasonable adjustments.
• Innovative and dynamic work environment with employee resource groups, including Pride Network and women's groups.