Principal Mechanical Engineer (Networking Systems)

Location: Onsite in Sunnyvale, California, United States; primarily working from an HPE office.

Base salary: USD 140,500–285,000 annual salary in California; variable incentives may also be offered.

Company

hirify.global develops edge-to-cloud technologies that help organizations connect, protect, analyze, and act on data and applications.

What you will do

• Own structural FEA simulation capabilities for NPI projects and sustaining issues, improving accuracy through test correlation and model refinement.
• Develop mechanical designs, chassis, fixtures, prototypes, and system packaging for complex networking products.
• Lead mechanical issue resolution during MDVT and HALT through simulation, testing, root-cause investigation, and validated design changes.
• Conduct strain-gauge, accelerometer, vibration, shock, thermal, and other laboratory testing, including analysis of microstrain, G-levels, and ASIC temperatures.
• Collaborate with ASIC, hardware, manufacturing, operations, suppliers, ODMs, and cross-functional teams on design, yield, manufacturability, and corrective actions.
• Document structural analyses, validation plans, specifications, design guidelines, project estimates, schedules, and technical recommendations.

Requirements

• 10+ years of experience in electromechanical product development, including networking, server, storage, telecommunications, or high-performance computing systems.
• MS in Mechanical Engineering, Applied Physics, or equivalent.
• Extensive experience with chassis development, system packaging, high-density electronic assemblies, and complex system-level mechanical designs.
• Experience with FEA and ANSYS Workbench, including static structural, modal, transient mode superposition, Eigenvalue-Buckling, and steady-state thermal analysis.
• Strong hands-on experience with tolerance analysis, GD&T, stack-up analysis, structural analysis, CAD, prototyping, testing, and root-cause investigations.
• Expert-level proficiency with 3D solid modeling; experience meshing sheet-metal geometries and simplifying meshes through defeaturing.
• Knowledge of load paths, material properties, thermal expansion, die warpage, heatsink loading, dynamic testing, strain-gauge applications, accelerometer data analysis, and response spectrum analysis.
• Familiarity with GR-63, IPC-9704, ASTM D4169, NEBS, EMI, EMC, safety, and other regulatory requirements.
• Experience with ECAD-MCAD integration, IDF workflows, manufacturing processes, tooling, volume production, and troubleshooting in laboratory, manufacturing, and field environments.
• Excellent communication and leadership skills, with the ability to influence cross-functional teams and lead corrective actions across the full product lifecycle.

Nice to have

• SolidWorks experience.
• Working knowledge of EPDM or equivalent PLM systems.
• Experience with LS-Dyna, response spectrum analysis, modeling die warpage, heatsink loading, strain-gauge training, dye-and-pry, Shadowmoire, and 3D-scanning metrology.

Culture & Benefits

• Health, financial, and emotional wellbeing benefits for employees and their loved ones.
• Programs supporting professional development and progression toward expert or cross-functional career paths.
• Inclusive workplace committed to accessibility and equal employment opportunity.
• Flexible support for managing work and personal needs, with onsite work required for this role.

Hiring process

• Applicants requiring disability-related accommodation during the application or interview process may submit a request through HPE’s accommodation form.