Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
Пожаловаться
Зарплата и рынок
Вышеразвернуть
$220к-280к/год
$170к$190кмедиана$230к
По похожим ролям (50) ~ $190к/год
На СНГ рынке: $2.5к/мес ($1.9к - $3.1к)
87
Хорошая вакансия
развернуть
Чётко описанная senior-роль в сфере AI-сетевого оборудования, с серьёзным финансированием и практическими задачами; при этом работа в офисе и стартап-среда несут определённые риски.
Выше рынка
AI-инфраструктура
Серьёзное финансирование
Понятная зона задач
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Подключить Plus
Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Senior Mechanical Design Engineer (AI Hardware): Develop chassis, line cards, cooling systems, cable harnesses, and connector assemblies for customized networking hardware supporting large-scale AI workloads with an accent on electro-mechanical design, manufacturability, and compliance. Focus on designing complex assemblies, performing tolerance analysis, creating detailed CAD documentation, and coordinating with hardware, thermal, manufacturing, and supplier teams.
Location: San Francisco County, California, United States
Salary: $220,000–$280,000 per year
Company
Develops customized networking hardware, software, and optics solutions for hyperscalers and large-scale AI workloads under a Joint Development Model.
What you will do
Develop chassis and line card designs meeting product, reliability, and scalability requirements.
Perform 2D/3D tolerance studies for complex electro-mechanical assemblies.
Design sheet metal, plastic, die-cast, and extrusion parts with attention to EMI, safety, and compliance.
Create CAD models, PCB outlines, detailed drawings, BOMs, ECOs, and part numbers.
Collaborate with hardware, thermal, CAD, manufacturing, and supplier teams to resolve issues and manage risks.
Design liquid or forced-air cooling systems and support OSFP, QSFP-DD, OSFP-XD, cable harness, front-panel, and backplane solutions.
Requirements
B.S. or higher in Mechanical Engineering.
5–10 years of mechanical design experience in telecom or data center hardware.
Proficiency in Creo and SolidWorks.
Strong understanding of EIA, ETSI, and OCP rack standards.
Experience with OSFP, QSFP-DD, and OSFP-XD connectors and backplane systems.
Hands-on experience with sheet metal, molding, casting, extrusion, cable harness, and liquid or air cooling design.
Comfort with rework tools and mock-up fabrication.
Nice to have
Familiarity with NEBS testing and compliance.
Culture & Benefits
Work on next-generation high-performance networking systems for large-scale AI workloads.
Collaborate across hardware, thermal, CAD, manufacturing, and supplier functions.
Join a well-funded, VC-backed startup with over $600M in funding and rapid expansion.
Будьте осторожны
Если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого. Это мошенники. Обязательно жмите «Пожаловаться» или пишите в поддержку. Подробнее в гайде →