Module Engineer (Semiconductor Manufacturing)

Location: Leixlip, Ireland; hybrid model with a minimum of 4 days per week on site

Annual salary: €49,300–€77,000, plus potential additional pay components and benefits.

Company

hirify.global’s Wafer Packaging Manufacturing organization in Ireland supports semiconductor production through advanced wafer bumping and interconnect formation processes.

What you will do

• Own module performance across safety, quality, output, and equipment metrics.
• Sustain and optimize wafer packaging processes for stable, repeatable, high-quality output.
• Use statistical methods and data analysis to reduce variation and improve process control.
• Lead structured problem solving and continuous improvement across cross-functional teams.
• Partner with 24/7 technician teams and suppliers to resolve issues and improve tool capability and reliability.
• Support technology ramps, tool installations, high-volume manufacturing transitions, and Virtual Factory best-practice deployment.

Requirements

• Level 8 qualification under Ireland’s National Framework of Qualifications in an approved science or engineering discipline, such as mechanical engineering, chemical engineering, materials science, electrical engineering, physics, or a related STEM field.
• At least 1 year of experience with a bachelor’s degree, or a completed master’s degree, in semiconductor or advanced manufacturing environments.
• Strong analytical and problem-solving capability, including using data to support decisions.
• Familiarity with statistical process control, data analysis tools such as JMP or SQL, and structured problem-solving methods.
• Understanding of semiconductor processes, equipment, or similar high-volume manufacturing systems.
• Foundation in process control, process improvement, and process characterization.

Nice to have

• Semiconductor experience and hands-on experience supporting or improving manufacturing processes or technologies.
• Ability to troubleshoot issues with pace and ownership.
• Strong communication and collaboration skills across teams.
• Experience with data analysis, data mining, or advanced analytics techniques.
• Track record of driving continuous improvement initiatives and building reliable, scalable processes.

Culture & Benefits

• Hands-on training and practical experience in advanced wafer packaging manufacturing.
• Hybrid work arrangement with substantial on-site presence.
• Competitive benefits and pay, including quarterly and annual bonuses and stock.
• Healthcare, pension, and 25 days of annual leave.
• On-site bank, gym, canteens, dental and optician services, EV charging, games areas, and sports and social clubs.
• Opportunities to contribute ideas, volunteer in the community, and collaborate across Ireland, Oregon, and New Mexico.

Hiring process

• Qualified applicants receive consideration without regard to protected characteristics under applicable law.
• Willingness to travel on assignment for varying durations may be required when business needs arise.