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13 дней назад

Chief Memory Chip Design Engineer & Architect (Memory)

242 900 - 323 800$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR
Chief Memory Chip Design Engineer & Architect (Memory): Defining end-to-end memory subsystem architecture and driving products from concept through production silicon with an accent on power, performance, area, physical architecture, and multi-generation scaling. Focus on arbitrating process, circuit, DFT, packaging, and controller trade-offs, owning EDA/CAD strategy, and guiding senior engineers through architecture and design reviews.

Location: San Jose Great Oaks Headquarters, San Jose, California, United States

Salary: $242,900–$323,800 per year

Company

hirify.global builds storage systems and infrastructure for AI-driven data centers, cloud platforms, and enterprise environments, combining engineering expertise with global-scale manufacturing.

What you will do

  • Own end-to-end product architecture from concept through silicon qualification and serve as the final technical authority across design, process, and product engineering.
  • Define memory subsystem architecture covering arrays, periphery, I/O, redundancy, test, and reliability, and translate product requirements into design specifications.
  • Drive floorplanning and physical architecture, including array efficiency, periphery partitioning, power delivery, and die-level signal integrity.
  • Own the multi-generation roadmap for node migration, density scaling, and performance scaling.
  • Arbitrate trade-offs across process integration, circuits, DFT, packaging, and controller/firmware interfaces.
  • Own design methodology and EDA/CAD strategy, mentor senior and principal engineers, and represent architecture to executives, customers, foundry partners, and standards bodies.

Requirements

  • MS or PhD in electrical engineering, computer engineering, or a related field.
  • 15+ years of memory or mixed-signal IC development experience, including 5+ years as an architect or chief engineer.
  • Ownership of at least two memory products from architecture through production silicon.
  • Deep advanced CMOS FinFET expertise covering layout, variability, reliability, and design for manufacturability.
  • Broad memory architecture experience across DRAM, NAND/NOR, SRAM, and emerging non-volatile memory, with deep expertise in one area.
  • Experience with modern Cadence and Synopsys custom and digital flows through full-chip sign-off.
  • Experience owning EDA/CAD strategy and leading multi-site programs through influence.

Nice to have

  • Embedded memory IP integration into SoCs and memory-controller co-design.
  • Foundry engagement on PDKs, test chips, and design-technology co-optimization.
  • Emerging non-volatile memory architecture experience, along with JEDEC involvement, patents, or publications.

Culture & Benefits

  • Full-time exempt employment at the San Jose Great Oaks headquarters.
  • Benefits include paid vacation and sick leave, medical, dental, and vision insurance, life and disability insurance, flexible spending and health savings accounts, and an employee assistance program.
  • Additional benefits may include tuition reimbursement, transit support, employee stock purchase opportunities, and the WD Savings 401(k) Plan.
  • Eligible employees may be considered for short-term incentives, long-term incentives, restricted stock units, or cash equivalents under applicable plans.
  • hirify.global provides equal employment opportunities and an inclusive workplace, with accommodation support available during the application process.

Hiring process

  • The anticipated application deadline is January 9, 2027, although the posting may close earlier if the role is filled.
  • Applicants requiring an accommodation should contact the provided accommodations email with the requested accommodation, job title, and requisition number.

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