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Текст:
Hirify AI/Оригинал
TL;DR
Chief Memory Chip Design Engineer & Architect (Memory): Defining end-to-end memory subsystem architecture and driving products from concept through production silicon with an accent on power, performance, area, physical architecture, and multi-generation scaling. Focus on arbitrating process, circuit, DFT, packaging, and controller trade-offs, owning EDA/CAD strategy, and guiding senior engineers through architecture and design reviews.
Location: San Jose Great Oaks Headquarters, San Jose, California, United States
Salary: $242,900–$323,800 per year
Company
hirify.global builds storage systems and infrastructure for AI-driven data centers, cloud platforms, and enterprise environments, combining engineering expertise with global-scale manufacturing.
What you will do
Own end-to-end product architecture from concept through silicon qualification and serve as the final technical authority across design, process, and product engineering.
Define memory subsystem architecture covering arrays, periphery, I/O, redundancy, test, and reliability, and translate product requirements into design specifications.
Drive floorplanning and physical architecture, including array efficiency, periphery partitioning, power delivery, and die-level signal integrity.
Own the multi-generation roadmap for node migration, density scaling, and performance scaling.
Arbitrate trade-offs across process integration, circuits, DFT, packaging, and controller/firmware interfaces.
Own design methodology and EDA/CAD strategy, mentor senior and principal engineers, and represent architecture to executives, customers, foundry partners, and standards bodies.
Requirements
MS or PhD in electrical engineering, computer engineering, or a related field.
15+ years of memory or mixed-signal IC development experience, including 5+ years as an architect or chief engineer.
Ownership of at least two memory products from architecture through production silicon.
Deep advanced CMOS FinFET expertise covering layout, variability, reliability, and design for manufacturability.
Broad memory architecture experience across DRAM, NAND/NOR, SRAM, and emerging non-volatile memory, with deep expertise in one area.
Experience with modern Cadence and Synopsys custom and digital flows through full-chip sign-off.
Experience owning EDA/CAD strategy and leading multi-site programs through influence.
Nice to have
Embedded memory IP integration into SoCs and memory-controller co-design.
Foundry engagement on PDKs, test chips, and design-technology co-optimization.
Emerging non-volatile memory architecture experience, along with JEDEC involvement, patents, or publications.
Culture & Benefits
Full-time exempt employment at the San Jose Great Oaks headquarters.
Benefits include paid vacation and sick leave, medical, dental, and vision insurance, life and disability insurance, flexible spending and health savings accounts, and an employee assistance program.
Additional benefits may include tuition reimbursement, transit support, employee stock purchase opportunities, and the WD Savings 401(k) Plan.
Eligible employees may be considered for short-term incentives, long-term incentives, restricted stock units, or cash equivalents under applicable plans.
hirify.global provides equal employment opportunities and an inclusive workplace, with accommodation support available during the application process.
Hiring process
The anticipated application deadline is January 9, 2027, although the posting may close earlier if the role is filled.
Applicants requiring an accommodation should contact the provided accommodations email with the requested accommodation, job title, and requisition number.
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