Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Зарплата и рынок
Выше рынка
$211к-264к/год
$170к$190кмедиана$210к
По похожим ролям (50) ~ $190к/год
На СНГ рынке: $1.9к/мес ($1.8к - $3к)
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Отличная вакансия
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Чёткая техническая роль, базовая зарплата выше рынка и хорошо финансируемая компания делают вакансию привлекательной, хотя обязательная работа в офисе и допуск к гостайне ограничивают доступность.
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Только офисНужен допускЗарплата выше рынкаКрупное финансированиеОборонная аэрокосмическая сфераЧёткая зона ответственности
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Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Senior Staff Electrical Engineer (Aerospace): Leading the design and lifecycle execution of high-reliability, high-speed digital circuit cards and subsystems for aerospace and military applications with an accent on signal integrity, power integrity, PCB architecture, and cross-disciplinary hardware leadership. Focus on resolving complex digital, FPGA, RF, power, EMI/EMC, thermal, and mechanical integration challenges while guiding verification, qualification, production transition, and field support.
Location: El Segundo, California, United States. Full-time, on-site position.
Salary: $211,000–$264,000 annual base compensation, excluding bonus, equity, and benefits.
Company
hirify.global develops defense products powered by Coherent Distributed Networks for warfighters, commercial air operators, and border protection teams. Founded in 2022, the company has raised $1 billion and is headquartered in Los Angeles with offices in Washington, D.C., San Francisco, San Diego, Seattle, and London.
What you will do
Lead the design and technical execution of high-speed digital circuit cards, complex PCBAs, and subsystems using FPGAs, processors, memory devices, data converters, clocks, and high-speed serial interfaces.
Lead architecture trades and define design approaches balancing performance, schedule, manufacturability, reliability, and qualification requirements.
Develop design practices for board design, stack-up definition, layout constraints, signal integrity and power integrity analysis, bring-up, and verification.
Resolve cross-disciplinary issues involving digital hardware, FPGA and software interfaces, RF coexistence, power distribution, EMI/EMC, thermal behavior, and mechanical packaging.
Provide technical direction for layout strategy, hardware integration, verification, qualification, production transition, failure analysis, and field support.
Serve as a technical interface for customers, vendors, suppliers, and program leadership while mentoring engineers and coordinating digital, FPGA, embedded software, RF, power, mechanical, manufacturing, and test teams.
Requirements
Bachelor's degree in Electrical Engineering and 12+ years of relevant engineering experience.
Demonstrated technical leadership of complex high-speed digital hardware designs.
Strong understanding of digital design fundamentals, including timing, clocking, controlled impedance, signal integrity, power integrity, grounding, decoupling, and return-path management.
Extensive experience designing digital boards with FPGAs, processors, memory devices, high-speed data converters, and board-level communication interfaces.
Experience defining or reviewing PCB layout strategy, design constraints, and analysis criteria for high-speed digital, mixed-signal, and high-reliability electronics.
Hands-on experience leading or supporting board bring-up, system integration, troubleshooting, verification, qualification, production transition, and failure analysis.
Demonstrated ability to lead technical execution and mentor engineers through ambiguous, cross-disciplinary hardware challenges.
Ability to obtain and maintain a U.S. security clearance.
Nice to have
Advanced degree in Electrical Engineering, Systems Engineering, Physics, Mathematics, or a related discipline.
Experience with avionics platforms and Altium Designer.
Expertise with signal integrity or power integrity tools such as HyperLynx, Sigrity, ADS, Ansys SIwave, or equivalent.
Experience with DDR, PCIe, Ethernet, JESD204, SERDES, LVDS, or similar high-speed interfaces in high-reliability systems.
Familiarity with EMI/EMC mitigation and aerospace standards including RTCA/DO-160, MIL-STD-461, MIL-STD-810, and MIL-STD-1275.
Experience developing design standards, analysis templates, qualification approaches, or review processes for engineering teams.
Experience designing for manufacturability and transitioning prototype hardware to production.
Culture & Benefits
Medical, dental, and vision benefits fully paid by the company.
401(k) with a 50% company match up to 6% of pay, plus FSA, HSA, and life insurance.
Relocation assistance, pre-IPO stock option grants, and annual bonuses planned.
Growing organization with 250 employees across five global offices.
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