Principal Product Manager - Platforms (Semiconductor)
Контакты
163 050 - 244 200$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
aiproduct managementfinancial modelingproduct strategysonicsemiconductorsdata center networkingopenconfigethernet switchinghyperscale infrastructure
Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Зарплата и рынок
Мало
$163к-244к/год
$200к$220кмедиана$240к
По похожим ролям (49) ~ $220к/год
На СНГ рынке: $4.2к/мес ($3.3к - $5.7к)
76
Хорошая вакансия
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Вакансия дает широкую ответственность на высоком уровне в растущей сфере инфраструктуры для ИИ-центров обработки данных, но базовая зарплата ниже медианы рынка, а требования к опыту в полупроводниках и сетях высокие.
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Ниже рынкаВысокие требованияИнфраструктура ИИАкции и бонусыПонятная зона ответственности
Оценка от Hirify AI
Мэтч & Сопровод
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Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Principal Product Manager - Platforms (Semiconductor): Owns the strategy, roadmap, and business execution for platform solutions serving hyperscale AI data centers, with an accent on data center networking, Ethernet switching, advanced packaging, and full product lifecycle management. Focus on translating hyperscale customer requirements into platform architectures, leading cross-functional execution, presenting financial and competitive analyses to executives, and delivering systems from market requirements through production.
Location: In-person in Santa Clara, California, United States
Base pay: $163,050–$244,200 per annum, plus eligibility for bonus and equity plans.
Company
hirify.global develops semiconductor solutions and platform technologies for enterprise, cloud, AI, carrier, networking, and data infrastructure markets.
What you will do
Own the product strategy and roadmap for switch-based platforms, CPO/CPC integrated platforms, and reference system architectures for hyperscale AI data centers.
Drive Market Requirements Documents and Product Requirements Documents through the full product lifecycle, from proposal approval to production.
Lead cross-functional alignment across engineering, program management, sales, marketing, and executive leadership.
Engage hyperscale customers to capture infrastructure requirements and translate them into product strategies.
Present business cases, competitive analysis, program status, and financial models to executive and C-level audiences.
Develop go-to-market collateral, reference architectures, and customer-facing technical content while monitoring the competitive landscape.
Requirements
Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field; a master’s degree is preferred.
10+ years of experience in product management, product marketing, or a related technical role in the semiconductor or networking industry.
Deep understanding of data center networking, Ethernet switching, scale-out and scale-up fabrics, and AI/HPC infrastructure.
Experience taking products through the full lifecycle from market requirements to production release.
Strong business acumen, including financial modeling for IRR, revenue forecasts, and competitive pricing.
Experience with hyperscale or cloud customers and the ability to influence cross-functional teams without direct authority.
Nice to have
Experience with co-packaged optics, co-packaged copper, or advanced packaging technologies.
Platform or systems-level product management experience at a semiconductor company.
Familiarity with SONiC, SAI, and OpenConfig for AI data center deployments.
Culture & Benefits
Employee stock purchase plan with a two-year lookback.
Bonus and equity plans, including a new-hire equity grant and annual equity refreshers.
Family support programs and mental and physical health resources.
Recognition and service awards for contributions and milestones.
Export-controlled technology access may require an export license review under U.S. regulations.
Hiring process
Interviews assess individual experience, thought process, and communication skills in real time.
AI tools, transcription applications, automated answer generators, and automated note-taking tools are prohibited during interviews.
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