Director High Performance Computing Power Modules (AI)

Location: Near hirify.global offices in San Jose, California, United States

Company

hirify.global manufactures discrete semiconductors and passive electronic components for automotive, industrial, computing, consumer, telecommunications, military, aerospace, and medical applications.

What you will do

• Define and execute the technology and product roadmap for high-performance computing power modules serving AI, GPU, CPU, server, networking, and data-center applications.
• Lead power module development from concept and technical specifications through qualification, production release, and market adoption.
• Direct cross-functional work across semiconductor technology, module and package design, electrical and thermal engineering, mechanical design, materials, reliability, manufacturing, and applications engineering.
• Translate strategic customer requirements into electrical, thermal, mechanical, and reliability specifications.
• Drive innovation in high-current, low-inductance, high-frequency, high-density, and advanced thermal-management solutions.
• Build, lead, and develop a global engineering organization, including recruitment, mentoring, performance management, and succession planning.

Requirements

• Bachelor’s degree in electrical engineering, power electronics, materials science, mechanical engineering, or a related technical discipline.
• 15+ years of relevant experience in semiconductors, power electronics, power modules, advanced packaging, or related technologies.
• Strong technical understanding of power semiconductor devices and power module technologies, including high-power or high-current applications.
• Experience leading complex product development organizations and global, cross-functional engineering teams.
• Experience working directly with major customers and technology partners.
• Understanding of product development from concept through production, including design for manufacturing and design for reliability.

Nice to have

• Advanced degree in a related technical discipline.
• Experience with HPC, AI, data-center power applications, GPU and CPU power delivery, VRMs, or multiphase architectures.
• Experience with MOSFETs, IGBTs, SiC, GaN, high-current DC/DC conversion, advanced packaging, thermal simulation, or cooling technologies.
• Experience with reliability qualification, high-volume semiconductor manufacturing, or automotive, industrial, or data-center power electronics.

Culture & Benefits

• Health care coverage and financial support programs.
• Open and collaborative work culture with local and global career opportunities.
• Stable business environment and opportunities for professional development.
• Workplace committed to equal employment opportunities and freedom from harassment and unlawful discrimination.