Field Applications Engineer (FAE) Intern - Summer 2027 (Semiconductors)

Location: Field Sales Offices across the United States, including Austin, Detroit, and San Jose; onsite office work with some local customer travel

Competitive paid hourly compensation

Company

hirify.global develops secure edge intelligence and semiconductor solutions for vehicles, factories, hospitals, homes, and connected devices.

What you will do

• Support FAEs in understanding customer requirements and selecting NXP microcontrollers, processors, connectivity, analog, power-management, and edge-processing solutions.
• Assist with customer meetings, design reviews, product evaluations, proof-of-concept activities, and technical demonstrations.
• Bring up evaluation boards and reference designs, configure SDKs, integrate example software, and develop or modify firmware and application code.
• Support embedded software debugging and system integration across real-time control, sensor interfaces, connectivity, Linux, and RTOS-based applications.
• Perform lab validation and troubleshooting using oscilloscopes, logic analyzers, multimeters, power supplies, probes, and software debug tools.
• Prepare technical presentations, guides, application notes, training materials, test plans, and a final capstone presentation.

Requirements

• Currently pursuing a Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, Mechatronics, or a related technical field.
• Rising junior, senior, or graduate student graduating between December 2027 and June 2029.
• Cumulative GPA of 3.0/4.0 or higher.
• Authorization to work in the United States is required; sponsorship is not available for intern roles.
• Availability for 12 weeks of full-time work during Summer 2027, from May through August.
• Clear communication, methodical debugging, ownership, collaboration, and interest in customer-facing technical work.

Nice to have

• Coursework or project experience in embedded systems, circuits, computer architecture, microcontrollers, processors, wireless communications, power electronics, control systems, or semiconductor applications.
• Hands-on experience with microcontrollers, MPUs, FPGAs, development boards, evaluation kits, reference designs, or ARM-based systems.
• Programming experience with C, C++, Python, IDEs, SDKs, version control, RTOS, or embedded Linux.
• Familiarity with UART, SPI, I2C, CAN, USB, Ethernet, schematic and PCB review, board bring-up, firmware debugging, sensor integration, motor control, edge AI, or robotics.

Culture & Benefits

• 12-week paid summer internship with meaningful technical work from the first day.
• Dedicated FAE/TSE mentor and day-to-day manager support.
• Hands-on exposure to requirements discovery, technical evaluation, proof-of-concept development, and design-in support.
• Professional development workshops, executive speaker sessions, and cross-functional networking.
• Structured learning on NXP products, embedded systems, customer applications, and the semiconductor industry.
• Potential relocation support or housing stipend depending on location, with consideration for a return offer to the TSAP program.

Hiring process

• Preferred location is discussed during the interview process.
• Applications are reviewed on a rolling basis.
• The internship concludes with a capstone presentation to sales and applications leadership.