Robotics Software Engineer (Semiconductor Equipment)

Location: Shanghai, China

Company

hirify.global develops inspection tools, metrology systems, process solutions, and computational analytics for semiconductor and electronics manufacturing.

What you will do

• Design, develop, test, and maintain software for robotic handling and automation systems.
• Implement motion control, robot path planning, sequencing, and machine control logic.
• Develop software for robot communication, device control, sensors, actuators, and vision systems.
• Optimize performance, reliability, and throughput for high-volume semiconductor manufacturing.
• Troubleshoot software and system integration issues and support product releases, customer escalations, and field issues.
• Collaborate with mechanical, electrical, systems, manufacturing, and field service engineers on architecture, code reviews, and continuous improvement.

Requirements

• Master’s or Ph.D. degree in Computer Science, Robotics, Automation Control, or a related field.
• At least 3 years of software development experience in robotics, automation, industrial equipment, or related areas.
• Strong programming skills in C++, C#, Java, or Python.
• Knowledge of object-oriented design, design patterns, multithreading, concurrent programming, data structures, and algorithms.
• Familiarity with machine control systems and industrial communication protocols, plus strong debugging and problem-solving skills.
• Good written and verbal English communication skills.

Nice to have

• Experience with semiconductor equipment, handlers, EFEM, wafer handling systems, or factory automation.
• Experience with robotics control, industrial automation platforms, robot kinematics, coordinate transformations, or motion planning.
• Experience with real-time systems or embedded software development.
• Experience working in global cross-functional engineering teams.

Culture & Benefits

• Work on advanced inspection, metrology, automation, and analytics technologies for semiconductor manufacturing.
• Collaborate across multiple engineering disciplines and Centers of Excellence.
• Competitive total rewards package with family-friendly benefits.
• Inclusive environment and equal opportunity employment.