10 дней назад
Manufacturing Engineer Packaging & OSAT
Вакансия из Hirify Global, списка международных tech-компанийДля мэтча и отклика нужен Plus
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Manufacturing Engineer Packaging & OSAT (AI semiconductors): Making advanced semiconductor packages manufacturable and transferring them into qualified OSAT processes, package test, board assembly, and final product integration with an accent on process capability, yield, reliability, and production readiness. Focus on leading factory commissioning, qualification builds, process transfer, supplier coordination, and resolving technical issues across package, assembly, test, and manufacturing operations.
Location: Remote based in Taiwan, with regular on-site presence at partner factories during qualification, commissioning, builds, and ramp activities.
Company
Tenstorrent develops high-performance AI computing technology spanning software models, compilers, platforms, networking, semiconductors, and RISC-V CPUs.
What you will do
- Own the manufacturing interface between package design, semiconductor assembly, package test, board assembly, and final product integration.
- Translate package requirements into assembly process flows, manufacturing specifications, control plans, inspection requirements, acceptance criteria, supplier deliverables, and manufacturing documentation.
- Lead factory commissioning, line bring-up, pilot and engineering builds, qualification lots, first article and reliability activities, production-readiness reviews, and partner audits.
- Establish and improve process capability and performance targets, including Cp/Cpk, yield, FPY, defect rates, test escapes, cycle time, OEE, and on-time delivery.
- Drive technical issue resolution and controlled changes across silicon, package, assembly, test, and factory operations.
- Coordinate with packaging, silicon manufacturing and test, quality, supply chain, PCB/board design, OSATs, suppliers, test houses, and contract manufacturers.
Requirements
- 5+ years of experience in semiconductor packaging, OSAT manufacturing, assembly engineering, PCBA manufacturing, product engineering, NPI, or a closely related environment.
- Experience with semiconductor assembly, package manufacturing, package test, board assembly, final product manufacturing, or taking manufacturing processes from development through sustaining operations.
- Experience working directly with OSATs, substrate and bumping suppliers, test houses, contract manufacturers, and other external manufacturing partners.
- Ability to interpret package drawings, BGA maps, BOMs, PCB data, process and quality reports, reliability results, and manufacturing documentation.
- Strong data-driven problem-solving and communication skills, with the ability to drive decisions across engineering, operations, quality, and suppliers.
- Working availability must support engagement with regional partners and engineering teams across multiple time zones.
Culture & Benefits
- Work on advanced AI computing, semiconductor packaging, and complex compute products.
- Learn how global OSAT and manufacturing-partner ecosystems support silicon, package, test, and system production.
- Develop expertise in process transfer, factory commissioning, qualification, line bring-up, and production ramp.
- Receive a competitive compensation package and benefits.
- Work in a collaborative environment that values curiosity and solving hard problems.
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