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Audio Firmware Engineer (Bluetooth)

193 300 - 289 900$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR
Audio Firmware Engineer (Bluetooth): Building and optimizing wireless audio firmware for PlayStation gaming peripherals with an accent on Bluetooth/BLE connectivity, low-latency audio paths, and hardware integration. Focus on designing pairing and provisioning flows, reconciling wireless and codec clocks, debugging RF-constrained systems, and delivering certification-ready firmware.

Location: United States, San Mateo, CA

Salary: $193,300–$289,900 USD annually

Company

hirify.global develops the PlayStation brand, including gaming hardware, network services, entertainment products, and consumer electronics.

What you will do

  • Own and develop firmware for gaming peripherals, including system architecture, technical leadership, and execution.
  • Design, implement, and debug Bluetooth and BLE features across RTOS, kernel drivers, systemd/D-Bus services, ALSA/ASoC, codec, and DSP drivers.
  • Build pairing, bonding, provisioning, GATT/GAP, and LE Audio/LC3 flows.
  • Optimize audio latency, buffering, clock synchronization, sample-rate conversion, jitter handling, low-power behavior, coexistence, and discovery.
  • Analyze packet captures, traces, performance data, I2S/SoundWire signals, and audio measurements; resolve interoperability, certification, and field issues.
  • Support OTA-safe configuration, telemetry, diagnostics, manufacturing builds, acoustic calibration, product bring-up, and post-launch products.

Requirements

  • Highly proficient in C/C++ with scripting experience in Python or shell.
  • Systems debugging experience with gdb, strace, logs, and packet traces.
  • Deep knowledge of Bluetooth Classic and BLE, including HCI, L2CAP, GATT/GAP, and profiles.
  • Hands-on experience with BlueZ and driver bring-up on ARM64 or x86 platforms.
  • Experience with A2DP, HFP, AVRCP, BAS, ASCS, and PACS for LE Audio.
  • Codec familiarity with SBC, AAC, aptX, LDAC, and LC3.
  • Deep experience shipping wireless features on Mac, Windows, or Linux-based platforms and/or Console SDK experience.
  • Experience with Bluetooth audio SoC vendor stacks such as Qualcomm QCC, Airoha, Realtek, or Nordic RnF; proprietary 2.4 GHz link design is also relevant.
  • Proven record of improving real-world performance and reliability under RF constraints; interest in gaming, digital entertainment, and consumer electronics.

Nice to have

  • DSP feature integration, including AEC, noise suppression, beamforming, sidetone, spatial audio, or HRTF.
  • Host-side audio experience with WASAPI/APOs on Windows or CoreAudio on macOS.
  • Secure Boot, signed images, key management for OTA, battery profiling, and power-state tuning.
  • Yocto or Buildroot experience.
  • Direct ODM/CM engagement in Asia.

Culture & Benefits

  • Small-team environment with a startup-like setting inside a large organization.
  • Hybrid working policy may affect the base pay range and individual compensation.
  • Medical, dental, vision, matching 401(k), paid time off, wellness program, and Sony product discounts.
  • Potential eligibility for a bonus package.
  • Background checks are conducted at the offer stage.

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