Software Engineer (Integrity 3D-IC Infra)

Location: Hsinchu, Taiwan; onsite full-time

Company

hirify.global develops software and solutions for electronic design automation and advanced semiconductor design.

What you will do

• Develop digital central solutions for 3D-IC applications.
• Build early-stage physical design flows, with a focus on pre-place-and-route methodology.
• Work with customers to understand design and advanced-node requirements.
• Collaborate with foundry partners to translate requirements into advanced software solutions.
• Debug and maintain large legacy codebases while improving software performance, capacity, and usability.

Requirements

• Strong knowledge of an object-oriented programming language, data structures, and algorithms.
• Primary experience with Java; familiarity with Tcl, Linux shell scripting, and minor C++ development.
• Knowledge of UNIX/Linux environments; Windows familiarity is beneficial.
• Strong analytical, problem-solving, organizational, presentation, and communication skills.
• Ability to work independently without a face-to-face working model and interact professionally across teams.
• Ability to communicate in English.

Nice to have

• Master's degree in Computer Science, Electrical Engineering, or a related field.
• Experience with EDA or CAD tools and desktop applications handling large-scale datasets.
• Familiarity with early-stage physical design flows before place-and-route.
• Experience with forward-deployed AI in engineering workflows.

Culture & Benefits

• Opportunities to develop expertise in large-scale data and software infrastructure.
• Career paths toward software architecture in system-level PPA, design ECO, and early-stage optimization flows.
• Work with customers and foundry partners on advanced technology requirements.