20 часов назад
Technical Program Manager (ASIC/Chiplet)
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Technical Program Manager (ASIC/Chiplet): Managing the development and delivery of electronic and photonic ASIC programs in advanced chiplet packages with an accent on cross-functional execution, external IP coordination, and silicon qualification. Focus on building program schedules, resolving integration and dependency risks, coordinating suppliers and qualification providers, and driving chip delivery through product release.
Location: Aachen, Germany; on-site
Company
develops graphene-based photonic solutions that connect chips into high-throughput, low-delay, energy-efficient computing networks.
What you will do
- Lead the end-to-end development and delivery of electronic and photonic ASIC programs, from concept through implementation, validation, qualification, and product release.
- Build program schedules, identify critical paths and bottlenecks, manage dependencies, and maintain execution against milestones.
- Coordinate cross-functional engineering teams and product management on integration plans, requirements, priorities, trade-offs, and risk mitigation.
- Manage third-party IP vendors, qualification providers, test houses, suppliers, and manufacturing partners against program deliverables.
- Manage chip delivery for development builds and ensure qualification supports mass-production schedules.
- Maintain program documentation and serve as the primary point of accountability for execution.
Requirements
- Bachelor’s degree in Engineering, Computer Science, or a related technical field, or equivalent practical experience.
- 5–8 years of experience managing silicon, ASIC, IP, or photonics development programs across the semiconductor product lifecycle.
- Experience with complex semiconductor programs involving external IP vendors, qualification providers, or test houses.
- Hands-on knowledge of ASIC and silicon development flows, chiplet or multi-die integration, qualification processes, PLM systems, risk management, change control, supplier coordination, and program tracking tools.
- Experience leading cross-functional engineering teams and working with product management, suppliers, manufacturing partners, and external stakeholders.
- Fluent English is required.
Nice to have
- German language skills.
- Program Management certification.
- Knowledge of chiplet architectures, advanced packaging ecosystems, semiconductor industry trends, and disruptive technologies.
Culture & Benefits
- Human-centric, flexible work culture focused on work-life harmony.
- Autonomy and continuous learning opportunities for professional and personal development.
- Benefits including insurance, pension, and virtual stock options.
- Open, inclusive, and collaborative environment focused on innovation and individual contribution.
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