Application Engineer (Semiconductor CMP)

Location: Hsinchu City, Hsinchu County, Taiwan

Company

hirify.global develops materials and solutions for advanced electronics and high-tech industries, including semiconductor and circuit board manufacturing.

What you will do

• Support the development of cleaning and slurry formulations using 300mm metrology tools to characterize planarization and clean performance.
• Establish advanced characterization methodologies for polish, planarization, and cleaning performance.
• Lead recipe development for new 300mm metrology tools.
• Provide timely technical support to customers in close collaboration with the Technical team.
• Educate application engineers, formulation scientists, and field service engineers on the fundamental physics of 300mm metrology tools.
• Support signal-clean tool and process setup in ATC.

Requirements

• Master’s degree in chemistry, chemical engineering, materials science, semiconductor-related studies, or a related field.
• 3–5 years of experience in semiconductor-related CMP applications.
• Strong interpersonal skills, teamwork, strategic thinking, and leadership potential.
• Proficiency with Excel, Access databases, Microsoft Office, visualization software, and data analysis.
• Fluent English writing, reading, and speaking skills required.
• High awareness of safety and business ethics.

Culture & Benefits

• Work with teams developing technologies for advanced electronics and high-tech industries.
• Collaborate across application engineering, formulation science, field service, technical, and customer-facing functions.
• Comprehensive pay and benefits package.
• Equal opportunity workplace with reasonable accommodation available during the application process.