Data Scientist (Manufacturing)

TL;DR

Data Scientist (Manufacturing): Developing data-driven solutions for Thermal Compression Bonding (TCB) process control and yield improvement with an accent on predictive modeling and manufacturing data analytics. Focus on building ML-based methods for excursion detection, tool health monitoring, and optimizing process stability in a semiconductor environment.

Location: On-site in Phoenix, Arizona, USA

Salary: $161,550–$228,070 USD

Company

hirify.global is a global leader in semiconductor manufacturing and technological advancements.

What you will do

• Analyze manufacturing, equipment, and yield data to identify root causes of process variation.
• Develop and validate ML models for process monitoring, yield prediction, and defect pattern analysis.
• Build proof-of-concepts for predictive analytics applied to TCB manufacturing.
• Collaborate with process and equipment engineers to translate manufacturing problems into scalable data solutions.
• Create dashboards and automated analysis tools to enhance production decision-making.

Requirements

• Degree in Computer Science, Data Science, Statistics, or Engineering (Bachelor's + 6y, Master's + 4y, or PhD + 2y experience).
• Strong proficiency in Python and JMP for data automation and model development.
• Experience with large manufacturing datasets and SQL for data extraction.
• Proven ability to apply AI/ML and statistical methods to solve engineering problems.
• Must be based in or be able to work on-site in Phoenix, Arizona.

Nice to have

• Experience in semiconductor assembly or advanced packaging.
• Knowledge of Advanced Process Control (APC), SPC, and run-to-run control.
• Experience with computer vision or automated inspection data.

Culture & Benefits

• Competitive industry-leading total compensation package.
• Stock bonuses and retirement programs.
• Comprehensive health and vacation benefits.