Principal Mechanical-Thermal Engineer (AI Infrastructure)

TL;DR

Principal Mechanical-Thermal Engineer (AI Infrastructure): Designing, analyzing, and validating high-bandwidth Ethernet switching systems for AI hyperscale data centers with an accent on thermal performance and mechanical integrity. Focus on liquid cooling solutions, structural analysis, and cross-functional integration from PCB to rack level.

Location: Yokneam, Israel

Company

A leading semiconductor solutions provider building essential data infrastructure for enterprise, cloud, and AI architectures.

What you will do

• Lead the mechanical and thermal design, simulation, and validation for next-generation switch systems.
• Develop reference designs tailored for AI hyperscale customers in data center environments.
• Collaborate with HW, SIE, FW, and silicon teams to optimize cooling solutions and power delivery packaging.
• Manage mechanical-thermal engagements with ODMs and component vendors.
• Execute lab experiments using DOE, measurement, and analysis to resolve mechanical-thermal failures.
• Oversee designs and structural integrity across PCB, chassis, and rack levels.

Requirements

• Bachelor's degree or above in Mechanical Engineering or related fields.
• 15+ years of professional experience as a Mechanical and Thermal Design Engineer in the electronics industry.
• Proficiency in industry-standard CAD, FEA, and ECAD-MCAD collaboration tools.
• Expertise in mechanical drawings, GD&T, and tolerance-analysis methods.
• Strong knowledge of Ethernet, PCIe, OCP, and JDEC industry standards.
• Experience with the design and testing of liquid cooling solutions, from cold plates to rack-level manifolds.

Nice to have

• Proven experience designing products for ML/HPC and data center applications.

Culture & Benefits

• Competitive compensation and comprehensive benefits package.
• Work environment characterized by shared collaboration, transparency, and inclusivity.
• Provision of tools and resources to support professional growth and development.