Postdoc Wafer-Level Packaging Using 3D Printing (Microelectronics)

TL;DR

Postdoc Wafer-Level Packaging Using 3D Printing (Microelectronics): Developing additive manufacturing strategies for low-cost and sustainable microneedle biosensor packaging with an accent on 3D printing and wafer-level fabrication. Focus on bridging semiconductor devices with reusable electronics through innovative 3D structures and co-designing packaging processes.

Location: Must be based in or relocate to Delft, Netherlands

Salary: €3,546 – €5,538

Company

hirify.global is a top international university combining science, engineering, and design to address global challenges in health, energy, and digital society.

What you will do

• Lead research into advanced packaging technologies for wearable biosensors.
• Develop wafer-level additive manufacturing strategies for low-cost, sustainable microneedle sensing systems.
• Fabricate 3D structures that bridge semiconductor devices and reusable electronics directly at the wafer level.
• Collaborate with a peer postdoc to co-design microneedle and packaging processes.
• Utilize state-of-the-art cleanroom facilities (EKL and Kavli) and novel 3D printing technologies.
• Publish research in leading scientific journals and collaborate directly with industry partners.

Requirements

• PhD in Electrical Engineering, Biomedical Engineering, Physics Engineering, Mechanical Engineering, or a related field.
• Experience in microfabrication.
• Experience in 3D printing of polymers.
• Fluent in English (writing and speaking).
• Ability to relocate to the Netherlands.

Nice to have

• Experience in 3D printing of conductive polymers.

Culture & Benefits

• Temporary 2-year contract with a 40-hour work week and flexible scheduling.
• Competitive salary and benefits per the Collective Labour Agreement for Dutch Universities.
• Excellent pension scheme via ABP and the ability to compile an individual employment package.
• Generous leave allowance (232 hours per year) with options to buy or sell hours.
• Comprehensive relocation support via the "Coming to Delft Service" and Dual Career Programme for partners.
• Access to professional development, training, and a vitality program.

Hiring process

• Submission of CV and motivational letter via the application portal by June 18, 2026.
• Knowledge security risk assessment conducted during the final stages of recruitment.