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3 дня назад

Reliability Engineer

Формат работы
hybrid
Тип работы
fulltime
Английский
b2
Страна
UK
Релокация
UK
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR

Reliability Engineer (Mixed-Signal IC): Driving qualification on new product developments for high-performance, low-power signal processing solutions in audio, voice, and haptics with an accent on reliability testing and risk assessment. Focus on defining and executing stress tests, evaluating silicon and packaging reliability, and ensuring compliance with industry standards like JEDEC.

Location: Edinburgh, Scotland (Hybrid). You must be based within commutable distance of the work location or willing to relocate prior to beginning employment. Export control restrictions apply; candidates must be able to access technical data without an export license.

Company

Developer of high-performance, low-power mixed-signal processing solutions for audio, voice, and haptics in mobile and consumer devices.

What you will do

  • Provide technical leadership in the global reliability engineering team.
  • Own and lead new product reliability and qualification plans from concept through mass production.
  • Support cross-functional teams in stress testing and qualification processes.
  • Collaborate with wafer fab, assembly, and packaging teams on silicon and component reliability.
  • Develop new reliability methodologies with internal and external groups.
  • Support customer quality engineering to meet internal and external standards.
  • Drive corrective and preventive actions with design, process, and manufacturing teams.

Requirements

  • BEng/BS in Engineering or Physics with hands-on experience in product reliability engineering.
  • Experience defining and executing IC reliability qualification plans per JEDEC and industry standards (e.g., Automotive, Industrial).
  • Working knowledge of intrinsic and extrinsic reliability requirements.
  • Ability to specify stress conditions (HTOL, HAST, TC, UHAST, ESD, Latch-Up), sample sizes, read points, and criteria.
  • Understanding of semiconductor device physics, IC manufacturing, and packaging technologies.
  • Excellent interpersonal and customer communication skills; understanding of quality systems.
  • Demonstrated analytical skills for data-driven resolution of issues.

Nice to have

  • Knowledge of Automotive reliability (AEC Q100).
  • Experience with common silicon and package failure mechanisms.
  • Ability to handle multiple projects and work in teams or independently.
  • Strong data analysis skills for technical problem resolution.

Culture & Benefits

  • Award-winning culture focused on inclusion, fairness, diversity, equality, and community engagement.
  • Collaborative environment with top engineers solving complex challenges for leading consumer brands.
  • Opportunities for career growth in an innovative, employee-centric workplace.

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