Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
Пожаловаться
Зарплата и рынок
развернуть
По международному рынку данных пока нет
На СНГ рынке: $2.5к/мес ($2к - $3.1к)
84
Хорошая вакансия
развернуть
Роль чётко определена и предполагает высокий уровень ответственности за передовые технологии упаковки полупроводников в крупной компании, но о льготах и повседневных условиях сказано мало.
Перспективное направление
Понятная зона ответственности
Крупный производитель
?Мало деталей о льготах
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Подключить Plus
Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
SMTS Integration Engineer (Advanced Packaging): Leading the integration and development of 2.5D and 3D heterogeneous semiconductor packaging solutions with an accent on interposer design, through-silicon vias, die stacking, thermal management, and production integration. Focus on coordinating cross-functional engineering projects, solving packaging integration challenges, optimizing process reliability, and mentoring engineers and technicians.
Location: Singapore
Company
hirify.global manufactures essential semiconductors for high-growth markets, including AI, through manufacturing operations across the U.S., Europe, and Asia.
What you will do
Lead integration activities for 2.5D and 3D heterogeneous packaging across design, process, and manufacturing teams.
Provide technical guidance on advanced packaging processes, materials, and equipment.
Develop project plans, timelines, and budgets while coordinating cross-functional milestones.
Develop and optimize processes involving interposers, through-silicon vias, die stacking, and thermal management.
Implement quality controls, documentation, validation, compliance, and continuous improvement activities.
Resolve technical integration issues and mentor junior engineers and technicians.
Requirements
Bachelor’s or master’s degree in electrical engineering, materials science, mechanical engineering, or a related field.
At least 10 years of semiconductor packaging experience, including at least 5 years in a leadership role focused on 2.5D and 3D heterogeneous integration.
In-depth knowledge of 2.5D and 3D integration, including interposer design, TSVs, die stacking, and system-in-package.
Proven experience managing complex projects with cross-functional teams.
Strong analytical, troubleshooting, and problem-solving skills.
Excellent verbal and written communication skills for conveying technical information clearly.
Collaborative leadership and mentoring skills, with the ability to work effectively in a team.
Commitment to innovation, continuous improvement, quality standards, adaptability, and effective work under pressure.
Culture & Benefits
Inclusive and multicultural workplace focused on productivity, innovation, and respect.
Employment is subject to successful background checks, applicable medical screenings, and local laws and regulations.
No recruitment fees are charged at any stage; applications must be submitted through the official hirify.global careers site.
Benefits information is provided through hirify.global’ Asia careers resources.
Hiring process
Apply through the official hirify.global careers site only.
Employment offers are conditional on applicable background checks and medical screenings.
Будьте осторожны
Если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого. Это мошенники. Обязательно жмите «Пожаловаться» или пишите в поддержку. Подробнее в гайде →