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5 дней назад

Process Engineer (3D Packaging)

Формат работы
onsite
Тип работы
fulltime
Английский
b2
Страна
Belgium
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Process Engineer (3D Packaging): Developing and validating die-bonding, lamination, singulation, and related materials processes for 3D heterogeneous integration and packaging applications with an accent on cleanroom process development, metrology, and materials characterization. Focus on transferring processes and tools into fab operations, starting up new equipment, and solving reliability challenges through failure analysis and cross-functional research.

Location: Leuven, Belgium; primarily working in a cleanroom environment.

Company

hirify.global is a nanotechnology research center developing advanced semiconductor, 3D integration, wafer-level packaging, MEMS, photonics, biomedical, and quantum computing technologies.

What you will do

  • Define, organize, set up, and validate singulation, lamination, and die-bonding processes.
  • Assist R&D engineers with process development on cleanroom tools for die-to-wafer bonding, temporary bonding and debonding, lamination, and singulation.
  • Identify metrology solutions and perform materials characterization and failure analysis.
  • Contribute to 3D, imagers and specialty components, and quantum computing research programs and joint development programs with external partners.
  • Coordinate non-standard fab work, process transfers, equipment start-up, and collaboration with integration, process support, hardware, pilot-line, and operations teams.
  • Report findings and identify future process and technology needs with device engineers, researchers, clients, and industrial partners.

Requirements

  • Preferably a master’s degree in chemistry, physics, materials science, or engineering.
  • Good spoken and written English is required.
  • Hands-on interest in working in a cleanroom environment.
  • Ability to work autonomously, stay organized, maintain attention to detail, and uphold high standards.
  • Strong scientific, engineering, networking, communication, and reporting skills.
  • Ability to participate in cross-functional projects and collaborate with researchers, PhD students, engineers, industrial researchers, clients, and partners.
  • Flexible attitude toward varied activities based on research-program needs.
  • Enthusiastic, creative, and collaborative approach in a multicultural team.

Nice to have

  • Foundry or OSAT experience with wafer-to-wafer bonding.
  • Background in semiconductor materials, including characterization and failure analysis.

Culture & Benefits

  • Open, multicultural, informal, and multidisciplinary working environment.
  • On-the-job coaching by senior researchers.
  • Development opportunities through hirify.global.academy, the corporate university.
  • Market-appropriate salary with fringe benefits.
  • Opportunity to take initiative and responsibility within a premier nanotechnology research center.

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