2027 Campus Software Engineer (Semiconductor)

Location: Shanghai, China; domestic and international travel may be required for training, meetings, and customer technical support.

Company

hirify.global develops semiconductor inspection tools, metrology systems, process solutions, and computational analytics for chip manufacturers and advanced electronics production.

What you will do

• Develop semiconductor-equipment software for Windows or Linux using object-oriented programming.
• Participate in requirements analysis, design, development, deployment, customer support, and service throughout the product development lifecycle.
• Deliver software solutions for metrology equipment, inspection equipment, and data-analysis products.
• Collaborate closely with global engineering teams.
• Travel domestically and internationally for training, meetings, and customer technical support as required.

Requirements

• Bachelor’s degree or above in computer science, software engineering, electronics, physics, automation, mathematics, or a related technical field.
• Proficiency in one or more object-oriented programming languages, including C, C++, C#, Java, PHP, Python, LabVIEW, or JavaScript.
• Familiarity with one or more development tools, such as Visual Studio, VS Code, Eclipse, or PyCharm.
• Strong knowledge of data structures, algorithms, multithreading, object-oriented analysis and design, and fundamental programming techniques.
• Excellent problem-analysis, problem-solving, and software-debugging skills.
• Fluent English and strong communication and teamwork skills are required.
• Commitment, focus, and a drive for excellence.

Nice to have

• Knowledge of network programming, database applications, software architecture, design patterns, unit testing, and software development processes.

Culture & Benefits

• Full-time campus opportunity within hirify.global’s Semiconductor Products and Customers business unit and Central Engineering organization.
• Work on inspection, metrology, analytics, automation, motion-control, sensor, platform-design, and packaging technologies.
• Collaborate with global teams on products supporting logic and memory chips, wafers, reticles, advanced packaging, and related semiconductor processes.
• Competitive, family-friendly total rewards package.
• Inclusive environment and equal-opportunity employment commitment.
• AI, recording tools, and other technologies may not be used to generate or provide interview responses unless approved as a reasonable accommodation or invited by the interviewer.