MTS - Advanced Packaging 2.5D and Deep Trench Integration Engineer (Semiconductor Packaging)

Location: Singapore; currently based in Singapore or willing to relocate to Singapore and work on site. Regular on-site engagement is required, with travel of up to 15% to other sites, suppliers, ecosystem partners, or customer locations.

Company

hirify.global is a full-service semiconductor foundry providing design, development, and fabrication services with a global manufacturing footprint.

What you will do

• Drive process integration for 2.5D and deep trench technology development programmes from requirements and experiments through qualification and manufacturing readiness.
• Integrate deep trench modules, including trench formation, dielectric and electrode materials, fill, planarisation, thermal processing, isolation, contact formation, and electrical characterisation.
• Integrate 2.5D solutions involving silicon interposers, TSVs, redistribution layers, wafer thinning and handling, bonding, assembly, and package flows.
• Plan test structures, process splits, and structured DOEs to establish process windows, understand module interactions, and retire technical risks.
• Analyze inline, physical, electrical, defectivity, yield, and reliability data; identify failure mechanisms and recommend corrective actions.
• Collaborate with engineering, manufacturing, equipment, reliability, test, design, customer, and partner teams while maintaining technical documentation and reporting project risks and milestones.

Requirements

• Bachelor’s degree or higher in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Physics, or a related technical field from a recognised institution.
• Relevant semiconductor process integration, device integration, advanced packaging, or technology development experience: at least 5 years with a B.S., at least 3 years with an M.S., or relevant research or industry experience with a Ph.D.
• Hands-on experience in deep trench integration and/or 2.5D technology development, with working knowledge of several relevant processes including deep trench etch, dielectric formation, trench fill, planarisation, thermal processing, electrical characterisation, silicon interposers, TSVs, redistribution layers, wafer thinning, bonding, assembly, or package qualification.
• Experience planning and executing experiments, analyzing technical data, troubleshooting process interactions, and supporting root-cause and corrective-action activities.
• Ability to work across cross-functional engineering and manufacturing teams and manage technical deliverables with limited supervision.
• Strong written and verbal English communication skills, including the ability to work across cultures and time zones.
• Currently based in Singapore or willing to relocate to Singapore and work on site.

Nice to have

• Advanced degree in a relevant engineering or science discipline.
• Experience with deep trench capacitors, deep trench isolation, or related high-aspect-ratio silicon structures, including etch, fill, stress, leakage, capacitance, and reliability challenges.
• Experience with 2.5D interposer or advanced packaging flows and electrical, thermal, mechanical, and manufacturability considerations.
• Experience in Singapore’s semiconductor ecosystem, including a wafer fab, foundry, OSAT, equipment or materials supplier, university, or research institute.
• Familiarity with semiconductor metrology, failure analysis, statistical data analysis, design of experiments, process control, qualification, and manufacturing hand-off.
• Ability to communicate complex technical findings clearly to engineering, management, customer, and partner audiences.

Culture & Benefits

• Work with local Singapore technology development and manufacturing teams and collaborate with global hirify.global sites and ecosystem partners.
• Support a multicultural, diverse, and inclusive workplace.
• All employment offers are conditional on successful background checks and applicable medical screenings under local laws.
• No recruitment fees are charged at any stage; legitimate recruitment communications use official hirify.global channels.
• Environmental, Health, Safety & Security requirements and programmes must be followed.