Summer 2027 Mechanical Engineer Intern - Bachelor's/Master's (Semiconductor Equipment)

Location: Santa Clara, CA, United States

Company

hirify.global develops and services materials science and engineering equipment for semiconductor manufacturing and advanced displays.

What you will do

• Support mechanical design and development of critical chamber hardware for semiconductor manufacturing equipment.
• Create and modify 3D CAD models, drawings, and engineering documentation.
• Design experiments, collect and analyze data, and present findings to project teams.
• Participate in prototype development, testing, and validation.
• Conduct root cause investigations and support failure analysis.
• Collaborate with manufacturing, quality, sourcing, suppliers, and other cross-functional teams to improve performance, reliability, manufacturability, and cost.

Requirements

• Currently pursuing a Bachelor's or Master's degree in Mechanical Engineering or a related engineering discipline.
• Available for a full-time internship during the summer or designated internship period.
• Good academic standing; a GPA of 3.0 or higher is preferred.
• Strong interest in product design, mechanical systems, and semiconductor manufacturing technologies.
• Fundamentals of mechanics, materials, heat transfer, fluid mechanics, and machine design.
• Strong problem-solving, analytical, and communication skills, with the ability to work effectively in a team and manage multiple priorities.

Nice to have

• Experience with Siemens NX, SolidWorks, Creo, or similar CAD platforms.
• Basic knowledge of Geometric Dimensioning & Tolerancing (GD&T).
• Familiarity with Finite Element Analysis (FEA) and engineering simulation tools.
• Knowledge of Design of Experiments (DOE), statistical analysis, or data analytics.

Culture & Benefits

• Supportive work culture focused on learning, development, and career growth.
• Health and wellbeing programs and a comprehensive benefits package.
• Full-time intern/student position with no travel required.
• Relocation eligible.

Hiring process

• Applications are reviewed on a rolling basis.
• Apply by December 31, 2026; the position may close early based on application volume or candidate selection.