13 дней назад
Summer 2027 Global Product Support Intern - Master's (AI)
Вакансия из Hirify Global, списка международных tech-компанийДля мэтча и отклика нужен Plus
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Summer 2027 Global Product Support Intern - Master's (AI) (Semiconductor Manufacturing/Data Analytics): Analyzing semiconductor manufacturing and equipment data to support defect troubleshooting, data-driven root cause analysis, and scalable digital solutions with an accent on AI, process engineering, and knowledge capture. Focus on identifying manufacturing trends, automating data capture, translating engineering knowledge into enterprise AI applications, and supporting global deployment and training.
Location: Santa Clara, CA, United States
Company
develops materials science, engineering, and semiconductor manufacturing equipment and solutions that support advanced chips and displays.
What you will do
- Analyze semiconductor manufacturing, equipment, and defect data to identify trends and potential root causes.
- Support FabVantage initiatives focused on process and equipment performance and advanced troubleshooting.
- Help translate engineering knowledge into scalable digital and enterprise AI solutions.
- Support AI adoption, data capture automation, knowledge management, and analytics initiatives.
- Collaborate with Customer Engineers, Process Engineers, technical experts, AI researchers, IT teams, and global stakeholders.
- Contribute to global deployment and training activities.
Requirements
- Master’s degree in Chemical Engineering, Electrical Engineering, or a related field.
- Experience with semiconductor or manufacturing data, equipment data, or defect analytics.
- Experience with Python, SQL, and data analysis tools such as Excel, Power BI, or Tableau.
- GPA of 3.0 or above preferred.
- Part-time, onsite position in Santa Clara, California; relocation is not eligible.
Culture & Benefits
- Supportive work culture focused on learning, development, and career growth.
- Exposure to semiconductor process engineering, equipment and defect analysis, advanced analytics, and enterprise AI applications.
- Employee health and wellbeing programs and support for personal and professional growth.
- Comprehensive benefits package, with potential eligibility for bonus and stock award programs.
- No travel required.
Hiring process
- Applications are reviewed on a rolling basis.
- Applications should be submitted by November 30, 2026; the position may close early depending on application volume or candidate selection.
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