Назад
Company hidden
5 дней назад

Vice President, Applications Engineering (FPGA)

309 203$
Формат работы
onsite
Тип работы
fulltime
Грейд
c_level
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
Для мэтча и отклика нужен Plus

Мэтч & Сопровод

Для мэтча с этой вакансией нужен Plus

Описание вакансии

Текст:
/
TL;DR
Vice President, Applications Engineering (FPGA): Leading global Applications Engineering, Verification, Foundation IP, Customer Enablement, and Customer Support organizations that deliver reusable IP, reference designs, evaluation kits, and customer-shipping FPGA solutions with an accent on technical customer engagement and scalable enablement. Focus on building multi-site engineering leadership, standardizing customer qualification, partnering with firmware and R&D executives, and managing the function's budget and headcount.

Location: San Jose, California, United States. The role leads a global multi-site organization across Penang, San Jose, Hillsboro, and Taipei. Applicants must provide satisfactory proof of the right to work in the United States.

Base pay range: $309,202.96 annually, plus potential variable or incentive compensation and equity.

Company

hirify.global develops low-power programmable logic, FPGA, CPLD, and programmable power management solutions for customers worldwide.

What you will do

  • Lead global Applications Engineering, Verification, Foundation IP, Customer Enablement, and Customer Support organizations.
  • Own reusable IP libraries, reference designs, technical collateral, evaluation kits, and customer enablement across Lattice product families.
  • Lead technical customer engagement from pre-sales and design-in through production ramp for hyperscaler, ODM, OEM, and industrial customers.
  • Own customer qualification methodology covering firmware type, boot and trust configuration, and target platforms.
  • Develop customer support, technical training, sample delivery, and evaluation platform strategies with regional engineering teams.
  • Hire, mentor, and promote technical leaders while managing the function's operating budget and headcount plan.

Requirements

  • Senior leadership experience across global, multi-site technical organizations.
  • Experience with FPGA platforms, firmware, reusable IP, customer applications, or related programmable logic solutions.
  • Ability to lead technical engagement with hyperscaler, ODM, OEM, and industrial customers.
  • Experience partnering with R&D, product lifecycle management, firmware, central engineering, finance, and executive leadership functions.
  • Must have the right to work in the United States.
  • Successful background and reference checks are required.

Culture & Benefits

  • Results-oriented, team-first environment focused on R&D, product innovation, and customer success.
  • Global collaboration across international engineering and manufacturing locations.
  • Competitive benefits package that may include healthcare, retirement plans, and paid time off.
  • Potential eligibility for variable or incentive compensation and equity.
  • Commitment to diversity and equal opportunity.

Будьте осторожны: если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого - это мошенники. Обязательно жмите "Пожаловаться" или пишите в поддержку. Подробнее в гайде →