5 дней назад
Vice President, Applications Engineering (FPGA)
309 203$
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Vice President, Applications Engineering (FPGA): Leading global Applications Engineering, Verification, Foundation IP, Customer Enablement, and Customer Support organizations that deliver reusable IP, reference designs, evaluation kits, and customer-shipping FPGA solutions with an accent on technical customer engagement and scalable enablement. Focus on building multi-site engineering leadership, standardizing customer qualification, partnering with firmware and R&D executives, and managing the function's budget and headcount.
Location: San Jose, California, United States. The role leads a global multi-site organization across Penang, San Jose, Hillsboro, and Taipei. Applicants must provide satisfactory proof of the right to work in the United States.
Base pay range: $309,202.96 annually, plus potential variable or incentive compensation and equity.
Company
develops low-power programmable logic, FPGA, CPLD, and programmable power management solutions for customers worldwide.
What you will do
- Lead global Applications Engineering, Verification, Foundation IP, Customer Enablement, and Customer Support organizations.
- Own reusable IP libraries, reference designs, technical collateral, evaluation kits, and customer enablement across Lattice product families.
- Lead technical customer engagement from pre-sales and design-in through production ramp for hyperscaler, ODM, OEM, and industrial customers.
- Own customer qualification methodology covering firmware type, boot and trust configuration, and target platforms.
- Develop customer support, technical training, sample delivery, and evaluation platform strategies with regional engineering teams.
- Hire, mentor, and promote technical leaders while managing the function's operating budget and headcount plan.
Requirements
- Senior leadership experience across global, multi-site technical organizations.
- Experience with FPGA platforms, firmware, reusable IP, customer applications, or related programmable logic solutions.
- Ability to lead technical engagement with hyperscaler, ODM, OEM, and industrial customers.
- Experience partnering with R&D, product lifecycle management, firmware, central engineering, finance, and executive leadership functions.
- Must have the right to work in the United States.
- Successful background and reference checks are required.
Culture & Benefits
- Results-oriented, team-first environment focused on R&D, product innovation, and customer success.
- Global collaboration across international engineering and manufacturing locations.
- Competitive benefits package that may include healthcare, retirement plans, and paid time off.
- Potential eligibility for variable or incentive compensation and equity.
- Commitment to diversity and equal opportunity.
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