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13 дней назад

Global Product Support Manager (Semiconductor Equipment)

181 000 - 265 467$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Global Product Support Manager (Semiconductor Equipment): Owning customer experience, cost of service, fleet availability, fleet performance, and field readiness for a semiconductor product family across its install-base lifecycle with an accent on escalation governance, financial performance, and new product introductions. Focus on coordinating NPI readiness, analyzing fleet data, improving service coverage, and leading matrixed teams across global regions.

Location: Milpitas, California, United States; 25–40% global travel required

Salary: $181,000–$265,467 annually

Company

hirify.global provides semiconductor inspection tools, metrology systems, process solutions, and computational analytics for electronics manufacturing.

What you will do

  • Own customer experience, service quality, escalation governance, and customer-facing reviews for a semiconductor product family.
  • Set Cost of Service targets, manage labor mix and utilization, and drive continuous improvement and FCO planning.
  • Own fleet availability and performance commitments, using field data to identify systemic risks and improve reliability.
  • Lead field readiness for new product introductions, including training, documentation, FRU planning, tooling, hedge kits, beta support, and readiness gates.
  • Set regional technical support coverage strategies and develop follow-the-sun operating models.
  • Coordinate matrixed work across NPI, Sustaining, Technical Support, Engineering, Manufacturing, and Division teams.

Requirements

  • 8+ years of experience in semiconductor capital equipment service, engineering, or operations, including 3–4+ years in leadership or management.
  • Bachelor’s degree or higher in Mechanical, Electrical, Industrial, or a related engineering field.
  • Direct customer-facing experience with top-tier semiconductor fabs and ownership of L4 or executive-visibility escalations.
  • Experience with Cost of Service, P&L, labor categorization, headcount planning, budgets, and forecasts.
  • Fluency with data and analytics; experience with Snowflake, Power BI, Streamlit, SQL, Python, or R.
  • Wafer-handler or server/data-system product experience and willingness to travel globally 25–40%.

Nice to have

  • Master’s degree in engineering or a related field.
  • Knowledge of advanced packaging, hybrid bonding, 3D NAND, EUV/High-NA, or AI/HPC silicon.
  • Experience with LLM copilots, agentic systems, vector search, and knowledge engineering.

Culture & Benefits

  • Full-time employment with medical, dental, vision, life, and voluntary benefits.
  • 401(k) with company matching and employee stock purchase program.
  • Paid time off, company holidays, and family care and bonding leave.
  • Tuition reimbursement, student debt assistance, financial planning, wellness, and career development programs.
  • Responsible use of AI is supported, while AI-generated responses are not permitted during interviews unless approved as an accommodation or invited.

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