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12 дней назад

Principal Advanced Packaging Engineer (Optical Chips)

Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
Taiwan
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Текст:
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TL;DR
Principal Advanced Packaging Engineer (Optical Chips): Leading R&D for next-generation optical-chip packaging technologies for NPO and CPO products with an accent on 2.1D, 2.5D, and 3D integration, EIC-to-PIC integration, and advanced process development. Focus on qualifying materials and equipment, improving yield and reliability, and developing packaging PDKs and design rules.

Location: Taipei, Taiwan

Company

hirify.global provides rack-scale AI infrastructure through semiconductor connectivity solutions and software for hyperscalers and ecosystem partners.

What you will do

  • Lead R&D for advanced packaging of optical chips across 2.1D, 2.5D, and 3D integration.
  • Define and optimize wafer-level, panel-level, and die-level packaging process flows.
  • Drive EIC-to-PIC integration and optical device integration for NPO and CPO products.
  • Select and qualify advanced packaging materials, equipment, and processes with OSATs, tool vendors, and material suppliers.
  • Characterize and improve package yield, reliability, and process capability.
  • Develop packaging PDKs and design rules for NPO and CPO products.

Requirements

  • B.S., M.S., or Ph.D. in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
  • 8+ years of semiconductor or advanced packaging engineering experience with demonstrated technical leadership.
  • Deep expertise in 2.5D/3D integration, flip-chip, hybrid bonding, Cu pillar, TSV, RDL, and overmold processes.
  • Experience with silicon photonics chip packaging and EIC/PIC integration.
  • Hands-on experience with underfill, molding compounds, dielectrics, adhesives, or optical-grade encapsulants.
  • Experience qualifying equipment and processes with OSATs or tool suppliers, plus yield, reliability, Cpk, SPC, PDK, and design-rule development.

Nice to have

  • Experience developing CPO or NPO products.
  • Experience with optical coupling or waveguide alignment for photonic integration.
  • Familiarity with DFM and DFT for advanced packaging.

Culture & Benefits

  • Opportunity to contribute to next-generation AI infrastructure and optical connectivity technologies.
  • Discretionary bonus, incentives, and benefits may be available depending on eligibility.
  • Inclusive environment that encourages applications from people with diverse backgrounds and experiences.

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