Эта вакансия в архиве
Посмотреть похожие вакансии ↓9 дней назад
Program Manager – Advanced Packaging (E4)
133 500 - 183 500$
Описание вакансии
Текст:
TL;DR
Program Manager – Advanced Packaging (E4) (semiconductor packaging): Leading advanced packaging and heterogeneous integration programs covering EMIB, CoWoS, multi-wafer stacking, TSV, micro-bump interconnects, and 2.5D/3D technologies with an accent on customer alignment, commercialization, and manufacturing readiness. Focus on managing cross-functional programs, optimizing thermal management, packaging reliability, yield, and technical risk across logic, DRAM, and NAND packaging architectures.
Location: Santa Clara, CA, United States; relocation eligible; travel required up to 20% of the time
Salary: $133,500–$183,500 per year
Company
develops and services materials engineering equipment used to manufacture semiconductor chips and advanced displays.
What you will do
- Lead the development and execution of advanced packaging and heterogeneous integration programs, including EMIB, CoWoS, multi-wafer stacking, TSV, micro-bump interconnects, and 2.5D/3D packaging.
- Coordinate R&D, process integration, design, manufacturing, suppliers, business units, sales, and external customers.
- Manage program timelines, milestones, technical risks, resources, deliverables, and commercialization activities through high-volume production.
- Lead customer programs covering technical alignment, schedule execution, issue resolution, and proactive communication.
- Develop solution strategies for logic, DRAM, and NAND packaging technologies, including chiplets, hybrid bonding, HBM, and 3D NAND.
- Communicate IMS value propositions and translate customer needs into technical solutions.
Requirements
- Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or an equivalent field.
- At least 5 years of program management experience in a customer-facing role.
- Proven experience driving technical programs with external customers.
- Strong understanding of advanced semiconductor packaging across logic, DRAM, and NAND.
- Excellent communication and presentation skills, with the ability to explain complex technical concepts and value propositions.
- Strong organizational, project management, prioritization, independent working, and global cross-functional coordination skills.
Culture & Benefits
- Supportive work culture focused on learning, development, and career growth.
- Comprehensive benefits package supporting employee health and wellbeing.
- Additional compensation may include bonus and stock awards, where applicable.
- Regular travel is required for approximately 20% of the time.