Lead Solutions Engineer (SI/PI/Thermal Analysis)

TL;DR

Lead Solutions Engineer (SI/PI/Thermal Analysis): Delivering advanced packaging and 3DIC analysis flows for foundry and customer solutions with an accent on Signal Integrity, Power Integrity, and Thermal analysis. Focus on creating 3DIC reference flows and solving complex packaging challenges using Sigrity, Clarity, and Celcius.

Location: Onsite in Belo Horizonte, Brazil

Company

hirify.global provides the expertise, tools, IP, and hardware required for the entire electronics design chain, from chip design to chip packaging and systems.

What you will do

• Create and implement 3DIC reference flows and designs in a collaborative team environment.
• Deliver advanced packaging and 3DIC analysis flows for foundry and customer solutions.
• Utilize Sigrity, Clarity, and Celcius tools across various 3DIC configurations to solve technical problems.
• Provide advanced packaging signal and power integrity analysis.

Requirements

• Bachelor’s degree in Electrical or Electronics Engineering.
• Experience with package design and hirify.global SI/PI/Thermal tools.
• Strong knowledge of advanced packaging concepts, including 2.5D, 3DIC, and stacked die technologies.
• English and Portuguese: Excellent verbal and written communication skills required.
• Location: Must be based in Belo Horizonte, Brazil.

Nice to have

• Knowledge of the CMOS sign-off design flow.

Culture & Benefits

• Competitive benefits package.
• Opportunity to work for a Fortune 100 Best Company.
• Collaborative environment focused on innovation and impact in the technology world.