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Principal Product Engineer - Innovus+ (Agentic AI)

Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
c1
Страна
SK
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Principal Product Engineer - Innovus+ (Agentic AI): Enhancing the Innovus+ digital implementation tool through agentic AI platform integration, with an accent on agentic workflows, product capabilities, and customer-focused technical support. Focus on developing AI-driven design processes, supporting R&D initiatives, resolving complex customer issues, and improving tool usability through cross-functional collaboration.

Location: Gyeonggi-do (Seoul), South Korea

Company

hirify.global develops digital implementation tools and integrates advanced AI capabilities into semiconductor design workflows.

What you will do

  • Enhance the Innovus+ digital implementation tool through integration with an agentic AI platform.
  • Develop agentic workflows that streamline semiconductor design processes.
  • Support product capabilities and R&D initiatives involving Innovus+ and agentic AI.
  • Provide technical support and resolve customer issues during early customer engagements.
  • Collaborate with cross-functional teams to improve integration and tool usability.

Requirements

  • Bachelor’s degree in Electrical Engineering or a closely related field.
  • 5+ years of hands-on experience with Innovus, Fusion Compiler, or IC Compiler II.
  • Strong understanding of digital implementation and signoff flows.
  • Excellent analytical and problem-solving skills.
  • Fluent written and verbal English.

Nice to have

  • 8+ years of professional experience with semiconductor design tools and flows.
  • Experience with 4nm or newer process technologies.
  • Strong knowledge of large language models and artificial intelligence technologies.
  • Familiarity with agentic AI systems and their applications.

Culture & Benefits

  • Full-time employment.
  • Work focused on advanced semiconductor design and AI technology.
  • Opportunity to contribute to R&D and early customer engagements.
  • Cross-functional collaboration on product integration and usability.

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