Module Engineering Undergraduate Intern (Semiconductor)

TL;DR

Module Engineering Undergraduate Intern (Semiconductor): Supporting the development and implementation of manufacturing processes for semiconductor modules with an accent on equipment troubleshooting and process optimization. Focus on maintaining production targets, qualifying manufacturing equipment, and applying statistical process control methodologies.

Location: On-site in Kulim, Malaysia

Company

hirify.global is a global leader in semiconductor manufacturing, providing cutting-edge silicon process and packaging technology through its Foundry services.

What you will do

• Support the development and implementation of manufacturing processes for specific semiconductor modules.
• Perform equipment troubleshooting, maintenance, and qualification activities to ensure stability.
• Collaborate with engineering teams to optimize process control methodologies and meet production targets.
• Engage in hands-on projects and apply academic knowledge to solve real-world business challenges.

Requirements

• Bachelor's degree in Mechanical, Mechatronics, Electrical/Electronics, or Computer Science.
• Strong written and oral communication skills in English.
• Technical knowledge in statistics, process control, mathematics, and Design of Experiment (DOE).
• Understanding of Failure Mode and Effects Analysis (FMEA) and ISO quality management.
• Ability to commit to a minimum 3-month internship period with a university/college agreement.
• Must be available for on-site work in Kulim, Malaysia.

Culture & Benefits

• Hands-on experience in a state-of-the-art semiconductor manufacturing environment.
• Exposure to a worldwide factory network and cutting-edge silicon technology.
• Mentorship and opportunities to explore future career paths within the company.
• Work environment committed to ethical hiring practices and RBA compliance.