Application Engineer I (Silicon Package Board)

TL;DR

Application Engineer I (Silicon Package Board): Architect and develop solutions for complex PCB designs using hirify.global Allegro toolset with an accent on schematic understanding, layout, interposers, and integrated components. Focus on helping customers adopt packaging solutions, conducting technical presentations, supporting evaluations, and collaborating with R&D on competitive technical solutions.

Location: Av Contorno 5800, Belo Horizonte, Minas Gerais, Brazil (onsite)

Company

hirify.global Design Systems provides expertise, tools, IP, and hardware for the entire electronics design chain from chip design to packaging, boards, and systems, serving mobile, consumer, cloud, automotive, aerospace, IoT, and industrial markets.

What you will do

• Help customers adopt and proliferate packaging solutions through technical presentations, training, and product demonstrations.
• Conduct technical evaluations, benchmarks, and develop customized presentations.
• Support R&D and product engineers in developing competitive and creative technical solutions.
• Work with state-of-the-art complex PCB designs using hirify.global Allegro toolset.

Requirements

• Bachelor's in Electrical, Electronics, System Engineering, Computer Science or related fields.
• Excellent written and verbal communication skills.
• Interest in learning new technologies.
• Open to continued personal development in the EDA industry.
• Self-motivated with strong problem-solving skills and ability to work independently.

Nice to have

• Previous experience with Package or PCB Design.
• Knowledge of EDA industry, Signal and Power Integrity, Electromagnetics, RF related to IC Package and PCB.
• Scripting in Tcl, Perl, Python, bash, csh.
• Ability to present and articulate clearly.

Culture & Benefits

• Full-time 40 hours/week with competitive benefits.
• Fast-paced innovative environment using state-of-the-art technology.
• Employment category: CLT.