Package PI/SI Engineer (AI/HPC)

Location: Onsite in Seongnam, Gyeonggi-do, South Korea

Company

hirify.global develops next-generation AI and high-performance computing semiconductor systems.

What you will do

• Lead the electrical integrity strategy for AI and high-performance computing systems.
• Perform DC/AC power integrity analysis, including IR drop and power delivery network impedance profiling.
• Run electromagnetic signal integrity simulations to address crosstalk, reflection, and insertion loss across PCIe Gen6, HBM3E, Ethernet, and die-to-die interfaces.
• Lead next-generation 2.5D/3D packaging and chiplet implementation.
• Develop automated design flows using advanced optimization techniques.
• Collaborate with DSP teams on implementation.

Requirements

• At least 5 years of relevant experience; the role description references more than 10 years of expertise for the principal-level scope.
• Expertise with SI/PI simulation tools such as ANSYS HFSS, SIwave, Cadence Sigrity, or Keysight ADS.
• Experience correlating simulations with measurements using VNA, TDR, and 10GHz+ oscilloscopes.
• Experience designing and optimizing multilayer semiconductor substrates and high-speed package architectures.
• Strong understanding of HBM3E PHY, die-to-die PHY, and Ethernet PHY.

Culture & Benefits

• Structured hiring process with document screening, online interview, onsite interview, culture-fit interview, compensation discussion, and final decision.
• Hiring stages and schedules may vary by role and circumstance.
• Candidate communication is handled by email throughout the process.