Principal Package PI/SI Engineer (AI)

TL;DR

Principal Package PI/SI Engineer (AI): Leading the electrical integrity strategy for high-performance AI computing systems with an accent on power delivery and signal fidelity for interfaces like HBM3E and PCIe Gen6. Focus on designing robust 2.5D/3D packaging solutions and automating design flows to ensure silicon-to-system performance.

Location: Must be based in Seongnam, South Korea (R-TOWER).

Company

hirify.global is a Korean AI semiconductor startup building high-performance AI and computing chips.

What you will do

• Perform DC/AC analysis including IR Drop and PDN impedance profiling for stable power delivery.
• Conduct electromagnetic simulations to mitigate crosstalk, reflection, and insertion loss for high-speed interfaces.
• Lead the implementation of next-generation packaging solutions including 2.5D, 3D, and chiplets.
• Develop automated design flows utilizing advanced optimization techniques.
• Collaborate with the DSP team to ensure seamless implementation and system integration.

Requirements

• 10+ years of professional experience in signal and power integrity.
• Expert-level proficiency in SI/PI simulation tools such as ANSYS HFSS, SIwave, Cadence Sigrity, or Keysight ADS.
• Proven ability to perform simulation vs. measurement correlation using lab equipment like VNA, TDR, and 10GHz+ oscilloscopes.
• Deep understanding of high-speed interface architectures.

Nice to have

• Experience with HBM3E PHY, D2D PHY, and Ethernet PHY.
• Background in designing high-speed package architectures for multi-layer semiconductor substrates.

Hiring process

• Application review, followed by an online interview and an on-site interview.
• Culture-fit interview and final compensation negotiation.