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Application Engineer I: Package And Interposer Design
Описание вакансии
Текст:
TL;DR
Application Engineer I (Package and Interposer Design): Architecting and developing solutions for challenging problems in advanced packaging design using state-of-the-art technology with an accent on highly integrated IC package co-design and multi-die chiplet methodologies. Focus on supporting customer adoption, conducting technical presentations, and collaborating with R&D on competitive technical solutions.
Location: Onsite in Belo Horizonte, Minas Gerais, Brazil
Company
is a leading company that provides expertise and tools, IP, and hardware required for the entire electronics design chain, enabling innovative product creation across various market segments.
What you will do
- Help customers adopt and proliferate packaging solutions.
- Conduct technical presentations, training, and product demonstrations, including customized presentations.
- Support technical evaluations and benchmarks.
- Collaborate with R&D and product engineers to develop competitive technical solutions.
Requirements
- Complete Bachelor's in Electrical, Electronics, System Engineering, Computer Science or related areas.
- Excellent written and verbal communication skills in English.
- Strong interest in learning new technologies.
- Open to continued personal development to meet the evolving demands of the EDA industry.
- Must be based onsite in Belo Horizonte, Minas Gerais, Brazil.
Nice to have
- Previous experience with Package or PCB Design.
- Knowledge of the EDA industry, Signal and Power Integrity, Electromagnetics, and RF related to IC Package and PCB Design.
- Ability to present and clearly articulate complex information.
- Knowledge of scripting programming languages such as Tcl, Perl, Python, bash, csh.
Culture & Benefits
- Work in a fast and innovative paced environment.
- Opportunity to develop as a leader and innovator.
- Be part of the "One -- One Team" culture.
- Enjoy competitive benefits.
- Standard employment term of 40 hours/week.