Advanced Packaging Development Engineer (Semiconductor)

TL;DR

Advanced Packaging Development Engineer (Semiconductor): Leading and innovating in 2.5D/3D packaging technology development with an accent on project management and team collaboration. Focus on driving technology innovation, development, and enablement in advanced packaging solutions.

Location: Onsite in Irvine, CA, USA

Salary: $127,100 - $203,400 annually

Company

hirify.global is a global technology leader that designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions.

What you will do

• Lead advanced packaging technology development projects.
• Innovate and enable new 2.5D and 3D packaging solutions.
• Manage projects related to advanced packaging technologies.
• Collaborate effectively within a team environment.

Requirements

• At least 15 years of experience in 2.5D / 3D packaging related development work.
• Strong project management skills.
• Expertise in technology innovation, development, and enablement.
• Must be able to work onsite in Irvine, CA, USA.
• US work authorization required.

Nice to have

• Ph.D. degree in a related engineering field.

Culture & Benefits

• Competitive and comprehensive benefits package including medical, dental, and vision plans.
• 401(K) participation with company matching and Employee Stock Purchase Program (ESPP).
• Company paid holidays, paid sick leave, and vacation time.
• Employee Assistance Program (EAP).
• hirify.global is an equal opportunity employer.