TL;DR

Principal Engineer - Packaging (Semiconductor): Responsible for advanced semiconductor package development within the FPGA Business Unit, ensuring packages meet electrical, mechanical, and thermal requirements. Focus on collaborating cross-functionally to solve technical problems, manage projects, and coordinate with assembly vendors from development to high volume production.

Location: San Jose, CA

Salary: $70,000 - $163,000

Company

%hirify_global% Inc. is a leading semiconductor company empowering innovation to enhance the human experience through its guiding values and commitment to employee development.

What you will do

Co-design packages with Silicon, Packaging, and Systems engineering teams.
Select the optimum package solution for new FPGA devices, balancing cost, performance, manufacturability, and reliability.
Learn and define assembly BOM, process, troubleshoot, and support packaging issues of new advanced technology.
Create package design documentation and assembly instructions.
Manage package qualification for commercial and automotive applications.
Coordinate with assembly vendors on new packages from development to high volume production.

Requirements

Bachelor’s or Master’s Degree in Electrical or Mechanical Engineering.
Minimum of 10 years of professional experience, including at least 5 years focused on semiconductor IC packaging.
Well versed with mid-range pin count packaging solutions, including but not limited to organic and ceramic flip chip BGA/LGA,WLCSP, wire bond BGA, and CSP.
Strong understanding of materials as related to chip packaging interaction.
Familiar with wafer BEOL (top metal, passivation, UBM, bumping etc.).
Knowledgeable in JEDEC, AEC and IPC requirements for component and board level reliability qualification.

Nice to have

Experience with Ansys Electronic Desktop
Knowledgeable with failure analysis techniques on package technologies
Experience with Cadence APD and AutoCad for custom substrate design.

Culture & Benefits

Competitive base pay, restricted stock units, and quarterly bonus payments.
Health benefits that begin day one and retirement savings plans.
Industry-leading ESPP program with a 2-year look-back feature.
Commitment to employee development and values-based decision-making.
Strong sense of community and diversity.