Senior Process Engineer Wafer Bonding & Assembly

Location: Leuven, Belgium; day-shift work

Company

hirify.global is a research center focused on nanotechnology and advanced technology development.

What you will do

• Own temporary wafer bonding and debonding processes and tools, including qualification, continuous improvement, problem prevention, and new process introduction.
• Manage wafer-level packaging processes including WLUF lamination, molding, CUF dispense, and TCB D2W bonding.
• Lead cross-functional improvements and structured problem-solving with R&D, engineering, operations, technical experts, and suppliers.
• Coordinate experiments involving new materials and substrates, including risk assessment and alignment between R&D and Engineering.
• Manage process control and documentation, including recipe management, SPC, procedures, technical escalations, upgrades, and recovery flows.
• Coach process engineers and share technical knowledge across the Wafer Bonding & Assembly team.

Requirements

• Master’s degree in Science or Engineering, or equivalent expertise gained through relevant experience.
• Strong engineering judgment and an analytical approach, with experience in process qualification, measurement, data interpretation, and quality assurance.
• At least 5 years of relevant experience in temporary wafer bonding and debonding and/or wafer-level packaging, including process or tool ownership and resolution of complex technical issues.
• Ability to work autonomously, prioritize technical challenges, and deliver well-documented, lasting improvements with close attention to quality and detail.
• Demonstrated ability to lead cross-disciplinary technical activities, align stakeholders, and coach less experienced engineers.
• Fluent English communication, including clear communication of technical findings, risks, and recommendations.
• Active knowledge sharing to support colleagues and strengthen team expertise.

Culture & Benefits

• Open, multicultural, and informal working environment.
• Opportunities to take initiative and demonstrate responsibility.
• Professional growth support and access to hirify.global.academy.
• Competitive salary with fringe benefits.