Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Здесь чётко определены лидерские задачи и ответственность за полный цикл разработки оборудования для гипермасштабируемых систем хранения; обязательная работа из офиса в Синьчжу ограничивает гибкость.
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Полный цикл продукта
Гипермасштабные системы
Руководство командой
Мэтч & Сопровод
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Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Engineering Manager - Hardware (DirectFlash Modules and High-Speed Storage Hardware): Leading development of next-generation DirectFlash Modules from architecture and schematics through validation and production release with an accent on high-speed hardware design, PCIe, signal and power integrity, and thermal dynamics. Focus on building multidisciplinary engineering teams, solving complex hardware failures, and coordinating U.S. architecture teams, vendors, manufacturers, and hyperscale integrators.
Location: Primarily in-office at the Hsinchu, Taiwan office; office location also listed in Zhubei, Taiwan.
Company
hirify.global has evolved from a storage pioneer into a data platform company serving hyperscalers, AI labs, the AI hardware supply chain, and the broader AI ecosystem.
What you will do
Lead, mentor, and develop a multidisciplinary team of hardware, PCIe, signal integrity/power integrity, and systems engineers.
Own the DirectFlash Module hardware and mechanical lifecycle from architecture and schematics through bring-up, EVT/DVT, failure analysis, and production release.
Develop hardware qualification strategies using automated test benches, stress testing, and systematic coverage reviews.
Drive root-cause analysis and reduce field escapes through quality-by-design practices.
Coordinate with U.S.-based architecture teams, flash controller vendors, contract manufacturers, and hyperscale system integrators.
Requirements
Experience leading, inspiring, and developing collaborative engineering teams in board design, hardware development, and system integration.
Hands-on expertise in high-speed hardware design, board bring-up, PCIe architectures, signal integrity/power integrity, and thermal dynamics.
Experience in enterprise storage, server, or hyperscale hardware environments.
Track record in hardware validation, design-for-manufacturing, design-for-test, root-cause failure analysis, and technical alignment with chip vendors, contract manufacturers, and system integrators.
Ability to collaborate across Firmware, Test, Quality, and Product Engineering disciplines spanning multiple international time zones.
Ability to work from the Hsinchu, Taiwan office in a primarily in-office environment, except during PTO, work travel, or other approved leave.
Culture & Benefits
Culture focused on critical thinking, innovation, technical growth, inclusion, and low-ego collaboration.
Flexible time off and wellness resources.
Company-sponsored team events.
Employee Resource Groups and inclusive leadership initiatives.
Accommodations are available for candidates with disabilities throughout the hiring process.
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