Semiconductor Trap Fabrication Scientist (Quantum Computing Hardware)

Location: Onsite in Brooklyn Park/Minneapolis, Minnesota, or at a supplier site in Malta, New York; U.S. Person status required.

Salary: USD 147,000–197,000 per year

Company

hirify.global develops a full-stack quantum computing platform for real-world applications across pharmaceuticals, materials science, financial services, government, industry, and research.

What you will do

• Develop and manufacture microfabricated ion traps through concept creation, design, layout, fabrication, packaging, and characterization.
• Develop designs and process flows for ion-trap features and components with integrated photonics.
• Assess current and future trap requirements and specify designs and processes that meet them.
• Translate system requirements into functional hardware with scientists, engineers, and technicians.
• Support supplier partnerships, third-party engagement, and co-development opportunities.
• Contribute to long-range planning for trap designs and fabrication processes.

Requirements

• Bachelor’s degree or higher.
• Experience with chip-scale photonics or integrated optics/waveguides.
• At least 3 years of MEMS or IC fabrication experience, including experience gained through a master’s degree or PhD.
• Must be a U.S. Person: U.S. citizen, permanent resident/green card holder, or person granted asylum or refugee status.

Nice to have

• PhD in Physics, Materials Science, or Engineering.
• Ability to apply physics and materials expertise to practical device designs.
• Experience interfacing with semiconductor foundries and working in microfabrication development or manufacturing environments.
• Experience with semiconductor and MEMS processes and tools, including layout, thin-film deposition, additive and subtractive patterning, photolithography, deep reactive ion etching, and process integration.
• Knowledge of on-chip photonics, wafer fabrication, and fiber-to-chip coupling.
• Experience with finite element modeling of mechanical, thermal, electrical, magnetic, optical, or multiphysics MEMS-like structures.
• Experience with 2.5D/3D semiconductor packaging, R&D, published research, and cross-functional teams.
• Results-oriented, self-directed working style with strong verbal and written interpersonal skills.

Culture & Benefits

• Full-time employment with a comprehensive rewards package and flexible work arrangements supporting work-life balance.
• Employer-subsidized medical, dental, and vision insurance.
• 401(k) plan with company match and student loan repayment benefit.
• Equity opportunities, paid time off, sick leave, 12 paid holidays, and paid parental leave.
• Applicants for safety-sensitive placement must complete a pre-employment drug test.