Назад
Company hidden
5 дней назад

Principal Process Integration Engineer (Semiconductor)

58 000 - 78 000GBP
Формат работы
hybrid
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
UK
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
Для мэтча и отклика нужен Plus

Мэтч & Сопровод

Для мэтча с этой вакансией нужен Plus

Описание вакансии

Текст:
/
TL;DR
Principal Process Integration Engineer (Semiconductor): Developing Trench MOSFET devices and process technologies for 200mm and 300mm semiconductor platforms with an accent on process integration, product qualification, and manufacturing sustainability. Focus on leading complex development projects, planning Design of Experiments, resolving fab yield issues, and mentoring process integration engineers.

Location: Manchester, United Kingdom; hybrid working policy

Base salary: £58,000–£78,000 per year, dependent on experience.

Company

hirify.global develops essential semiconductor technologies through next-generation manufacturing, process improvement, and advanced production facilities.

What you will do

  • Develop Trench MOSFET technologies for 200mm and 300mm platforms with third-party vendors and fabs.
  • Execute major process development and integration tasks while building product and process integration knowledge.
  • Lead projects and sub-projects involving complex process development and integration work.
  • Support qualification of new process and product developments, including substrate and epitaxy processes.
  • Plan and execute Design of Experiments, present findings and conclusions, and implement technical development procedures and standards.
  • Provide technical mentoring and support crisis management for fab yield issues and process excursions.

Requirements

  • Master’s degree in Semiconductor Device Physics, Semiconductor Technology, Microelectronics, or a similar field with 6 years of experience, or a Ph.D. with 2 years of experience.
  • Good knowledge of working in a semiconductor fab in process integration.
  • Thorough knowledge of semiconductor process modules, including mask, etch, PVD, CVD, and diffusion.
  • Strong verbal and written communication skills and the ability to work independently with minimal supervision.
  • Team-oriented approach and a strong drive to achieve results.
  • Willingness to travel up to 10%.

Nice to have

  • Knowledge of Trench MOS on low-voltage 30/40/60V and high-voltage 80/100/150V platforms.

Culture & Benefits

  • Annual Incentive Plan, contributory pension scheme, recognition rewards, income protection, and life assurance at 12 times salary.
  • Hybrid working, 33 days of annual leave including bank holidays, flexible benefits, enhanced sick pay, on-site medical centre, subsidised canteen, and employee assistance programme.
  • Funded academic support up to PhD level, development plans, and opportunities to work with cutting-edge technologies and progress globally within the business.
  • Commitment to carbon neutrality by 2035, paid time off for charitable work, employee resource groups, and an inclusive, accessible workplace with reasonable adjustments where requested.

Hiring process

  • Stage 1: Recruiter review.
  • Stage 2: Teams interview.
  • Stage 3: On-site or Teams final interview and assessment.

Будьте осторожны

Если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого. Это мошенники. Обязательно жмите «Пожаловаться» или пишите в поддержку. Подробнее в гайде →