3D Interconnects R&D Project Leader

Location: Leuven, Belgium

Company

Join hirify.global, a premier nanotechnology research center developing semiconductor and 3D integration technologies.

What you will do

• Lead the development of innovative devices for 3D interconnect applications from design through device validation.
• Define and implement project plans with expert teams, resource managers, and FAB managers in line with customer needs and hirify.global’s R&D strategy.
• Lead the team technically and operationally while promoting collaboration, innovation, and continuous improvement.
• Monitor project performance and resources, manage changes, accelerate activities when needed, and escalate issues or showstoppers.
• Act as the main customer contact from project definition through closure, reporting progress and responding to technical requests.

Requirements

• PhD or MSc in microelectronics, electrical engineering, physics, applied physics, material science, or a closely related discipline.
• At least 5 years of experience in the semiconductor field, including process, integration, device, reliability, and/or design.
• Experience and knowledge of integration flows related to compute technologies, including logic, 3D, and nano-interconnect, are required.
• Strong customer orientation and ability to build lasting relationships.
• Adaptability to diverse projects or research topics, with the ability to support colleagues and deliver projects within agreed timelines.

Nice to have

• In-depth knowledge of 3D interconnect technology and integration flows.
• Prior industrial experience as an R&D project manager, program manager, or team leader.

Culture & Benefits

• Open, multicultural, and informal working environment with opportunities to take initiative and responsibility.
• Support and guidance for technical and personal development through hirify.global.academy.
• Market-appropriate salary with fringe benefits.
• Inclusive employer committed to supporting employee growth.