8 дней назад
Software Engineer SLAM
Вакансия из Hirify Global, списка международных tech-компанийДля мэтча и отклика нужен Plus
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Software Engineer SLAM (SLAM/robotics): Developing SLAM algorithms and sensor-processing pipelines for mobile mapping systems that generate point clouds and maps with an accent on algorithm accuracy, robustness, performance, and automated software delivery. Focus on evaluating geometry and optimization methods, processing raw sensor data, and improving automated tests for realistic 3D representations.
Location: Munich, Germany — hybrid work setup
Company
develops reality-capture and digital-factory solutions that create photorealistic digital twins, floor plans, point clouds, and panoramic images.
What you will do
- Develop SLAM algorithms at the core of mobile mapping devices.
- Evaluate the accuracy, robustness, and performance of algorithms and sensors.
- Build and improve processing pipelines from raw sensor data to point clouds and maps.
- Continuously improve automated tests and automated software delivery.
- Collaborate with experienced engineers in the Mapping & Perception team.
Requirements
- Master’s degree or PhD in computer science or a similar field, ideally specializing in robotics or SLAM.
- 3–5 years of professional software development experience with modern C++ and Python.
- Strong foundation in geometry and optimization.
- Interest in current advances in robotics, SLAM, and software development.
- Fluent English required.
- Structured, self-managed, communicative, and collaborative working style.
Culture & Benefits
- 30 days of paid time off per year.
- Flexible working hours and a hybrid work setup.
- Full visa and relocation support for international candidates.
- Fitness and wellness subsidy through EGYM Wellpass.
- Deutschlandticket subsidy, JobRad bike leasing, and support for local language classes.
- International environment with more than 300 employees from around 60 nationalities.
Hiring process
- Initial screening call followed by up to four interview rounds.
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